Multi-pad chemical mechanical grinding device

A grinding device and chemical mechanical technology, applied in the direction of grinding tools, etc., can solve the problems of low work efficiency, long replacement time of grinding pads, etc., and achieve the effect of improving work efficiency

Active Publication Date: 2014-07-09
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a multi-pad type chemical mechanical polishing device to solve the problems of low working efficiency of chemical mechanical polishing equipment in the prior art and long replacement time of polishing pads

Method used

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  • Multi-pad chemical mechanical grinding device
  • Multi-pad chemical mechanical grinding device
  • Multi-pad chemical mechanical grinding device

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Embodiment Construction

[0028] A multi-pad chemical mechanical polishing device proposed by the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will be apparent from the following description and claims. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

[0029] Please refer to image 3 , which is a schematic structural diagram of a multi-pad chemical mechanical polishing device according to an embodiment of the present invention. Such as image 3 As shown, the multi-pad chemical mechanical polishing device 2 includes:

[0030] Grinding platform 20 and grinding pad group 30;

[0031] The grinding pad group 30 is fixed on the grinding platform 20;

[0032] The polishing pad set 30 includes a plurality o...

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Abstract

The invention relates to a multi-pad chemical mechanical grinding device which comprises a grinding platform and a grinding pad group. The grinding pad group is fixed on the grinding platform and comprises a plurality of grinding pads which are embedded together. The device adopts the structure of the plurality of grinding pads which are in embedding fit. By means of the structure, the grinding pads can be replaced quickly. Further, the device comprises a height adjusting device, the grinding pad height can be adjusted automatically, and the working efficiency of the grinding device is improved.

Description

technical field [0001] The invention relates to the technical field of chemical mechanical polishing, in particular to a multi-pad chemical mechanical polishing device. Background technique [0002] Chemical mechanical polishing (chemical mechanical polishing) technology has both the functions of mechanical polishing and chemical polishing, which can make the surface of the semiconductor wafer smoother and flatter, which is beneficial to the subsequent process. At present, chemical mechanical polishing technology is widely used in the manufacture of semiconductor wafers, and chemical mechanical polishing equipment is used in the wafer planarization process. Such as figure 1 As shown, the chemical mechanical polishing equipment 1 includes a polishing platform 10, a polishing pad 11, a polishing head 12, a polishing liquid delivery device 13, a polishing head rotating device (not shown in the figure) and a polishing platform rotating device (not shown in the figure) . The w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/22B24B37/26
CPCB24B37/22B24B37/26
Inventor 唐强汪坚俊
Owner SEMICON MFG INT (SHANGHAI) CORP
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