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Post-cmp cleaning apparatus and method

A chemical-mechanical and clean technology, applied in the manufacture of electrical components, circuits, semiconductors/solid-state devices, etc., can solve the problems that the bonding characteristics have not been raised or have been fully raised, and achieve the effect of easy deformation

Inactive Publication Date: 2014-07-09
ENTEGRIS INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These different bonding properties have not been proposed or sufficiently addressed before

Method used

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  • Post-cmp cleaning apparatus and method
  • Post-cmp cleaning apparatus and method
  • Post-cmp cleaning apparatus and method

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Embodiment Construction

[0051] While various combinations and methods are described, it is to be understood that this invention is not limited to the particular combinations, designs, methods or protocols described, as these may vary. It should also be understood that the terminology used in the specification is for the purpose of describing particular versions or embodiments only, and is not intended to limit the scope of the present invention, which is limited only by the appended claims. The term "protrusion" and the term "nodule" may be used interchangeably to describe the features of the post-CMP cleaning brushes described herein, as is well known to those skilled in the art. The substrate here is a wafer or other substrates such as flat panels, solar panels, and the like.

[0052] A nodule according to an embodiment of the invention is asymmetrical about a vertical plane normal to the page. On cylindrical brushes this is dependent on the axis of the brush and transitions to a plane through the...

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Abstract

A brush for cleaning of substrates such as for post chemical mechanical polishing (post-CMP) of the substrates, utilizes asymmetrical nodules or nodules with varying spacing, size, features, densities to provide an improved cleaning of substrates.

Description

[0001] This application claims priority to US Provisional Application No. 61 / 539,342, filed September 26, 2011. technical field [0002] The present invention generally relates to chemical mechanical polishing (CMP) of substrates. More specifically, the present invention relates to brushes for cleaning substrates after chemical mechanical polishing. Background technique [0003] An integrated circuit (Integrated Circuit) can be formed on a semiconductor substrate, especially a silicon wafer, by sequentially depositing a conductive layer, a semiconductive layer, and an insulating layer on a wafer. After each layer is deposited, circuit features can be etched on. As a series of layers are deposited and etched, the uppermost surface of the substrate may become increasingly uneven. Uneven surfaces can cause problems during the photolithography step of the integrated circuit fabrication process. In this way, it is necessary to periodically planarize the surface of the semicond...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304H01L21/302
CPCH01L21/67046H01L21/02074
Inventor 钦腾·帕特尔
Owner ENTEGRIS INC