Wafer test result map mark modification method

Abstract

The invention provides a wafer test result map mark modification method. The wafer test result map mark modification method comprises the steps that firstly, a wafer test result map text file is generated automatically according to a wafer test result map; secondly, the generated wafer test result map text file is automatically identified through a program Excel Macro so that unqualified invalid bare chips can be marked; thirdly, additional marking is automatically conducted on qualified wafers surrounding the invalid bare chips according to the invalid bare chips in the program Excel Macro; fourthly, format conversion is conducted on the wafer test result map text file after additional marking through a program Perl script.

Description

technical field [0001] The invention relates to the field of analyzing and improving the yield rate of semiconductor products, and more specifically, the invention relates to a method for modifying the mark of a wafer test result graph. Background technique [0002] Wafer test (CP test, also known as chip functional test) is a wafer-level test. Wafer testing tests the bare die before chip dicing and packaging to test whether the die is qualified. [0003] After the chip function test, a wafer test result map (CP Map: Chip probe Map) representing the distribution of chip function test results will be obtained. In the wafer test result diagram, generally, the qualified dies that pass the chip function test (generally can be marked as Bin1 type) and the unqualified die that fail the chip function test (that is, failed dies) (generally can be marked as Bin class) are marked out respectively. [0004] The wafering customer will select the bare die according to the wafer test r...

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Problems solved by technology

[0005] Since the distribution shapes of the unqualified die in the chip function test on the wafer test result map may be various, it is difficult to automatically mark the periphery of the unqualified die in different distribution forms. The traditional method can only Manually complete the labeling in the document of the wafer test result map

[0006] Since there are usually a lot of wafer test result graphs that need to mark bare chips, and hundreds of wafers may be involved in the mass production process, wafer test result graphs need to be processed in this way, so manual processing is very time-consuming and may be lost due to human negligence. mistake

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