Material taking suction nozzle of chip mounter
A chip mounter and nozzle rod technology, which is applied in the direction of assembling printed circuits with electrical components, can solve the problems of reduced sealing performance of the nozzle, affecting the suction of the nozzle, and increasing the failure rate, and achieves the effect of convenient replacement
Inactive Publication Date: 2014-08-06
SUZHOU BECHENLAI ELECTRONICS
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Problems solved by technology
[0003] According to different components, the size of the suction nozzles required is also different. In order to adapt to different components, the suction nozzles of the existing placement machines mostly use replaceable suction nozzles, but the suction nozzles of the existing placement machines are all made of the suction nozzles. Replacement as a whole, repeated replacement of the suction nozzle many times in this way will cause the sealing performance of the suction nozzle to decrease, affect the suction of the suction nozzle, and lead to an increase in the failure rate
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[0018] The present invention will be specifically introduced below in conjunction with the accompanying drawings and specific embodiments.
[0019] Such as figure 1 The pick-up nozzle of the chip mounter shown includes: a nozzle rod 2, a nozzle 10 detachably connected to the nozzle rod 2, a spring 3 is arranged between the nozzle rod 2 and the nozzle 10, and the spring 3 acts as a suction nozzle. The buffer function between the mouth rod 2 and the suction nozzle increases the buffer when the suction nozzle 10 moves up and down, and protects the suction nozzle 10 and the suction nozzle rod 2 . The suction nozzle 10 includes: a suction nozzle connecting portion 11 connected with the suction nozzle rod 2 , and a detachable nozzle head 12 in contact with the electronic components. A limit step is provided at the connection between the nozzle connecting portion 11 and the nozzle rod 2, a limit protrusion is provided at the connection between the nozzle rod 2 and the nozzle connect...
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The invention discloses a material taking suction nozzle of a chip mounter. The material taking suction nozzle comprises a suction nozzle rod and a suction nozzle detachably connected with the suction nozzle rod. The material taking suction nozzle of the chip mounter is characterized in that a spring is arranged between the suction nozzle rod and the suction nozzle, the suction nozzle comprises a suction nozzle connecting part connected with the suction nozzle rod and a detachable suction nozzle head part making contact with an element, a limiting step is arranged at the joint between the suction nozzle connecting part and the suction nozzle rod, a limiting protrusion is arranged at the joint between the suction nozzle rod and the suction nozzle connecting part, a washer is arranged between the limiting protrusion and the limiting step, an inner thread is arranged at the joint between the suction nozzle connecting part and the suction nozzle head part, the suction nozzle head part is provided with a groove connected with the suction nozzle connecting part, and a connection thread matched with the inner thread is arranged in the groove. The material taking suction nozzle of the chip mounter has the advantages that the detachable suction nozzle head part can meet the requirements for suction nozzles of different electronic elements, and therefore the suction nozzle can be conveniently replaced and the overall sealing performance of the suction nozzle cannot be affected. Due to the fact that a filtering device is arranged, dust can be blocked, and the sealing performance of the suction nozzle is not affected.
Description
technical field [0001] The invention relates to a component of a placement machine in the field of SMT processing, in particular to a pick-up nozzle of a placement machine. Background technique [0002] SMT is the abbreviation of Surface Mount Technology, which is the most popular technology and process in the electronic assembly industry. According to the needs of mass production, placement machines are now used to mount various circuit boards. During the mounting process of the placement machine, the vacuum flow channel suction nozzle is used to pick up the components and place them on the circuit board. [0003] According to different components, the size of the suction nozzles required is also different. In order to adapt to different components, the suction nozzles of the existing placement machines mostly use replaceable suction nozzles, but the suction nozzles of the existing placement machines are all made of the suction nozzles. Replacement as a whole, repeated re...
Claims
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IPC IPC(8): H05K3/30
Inventor 李勇孙敏强
Owner SUZHOU BECHENLAI ELECTRONICS