Backlight module, surface-mounted LED and packaging technology of surface-mounted LED

A technology of packaging technology and backlight module, which is applied in the direction of electrical components, electrical solid devices, circuits, etc., can solve the problems of unfavorable cost reduction, product thickening, and increased cost of manual lens attachment, so as to reduce production costs, improve efficiency, The effect of omitting costs

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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

In the direct-lit backlight technology, there is no need for a light guide plate to transmit the light of the LED. It mainly uses a small-sized LED lamp bead plus a lens to form a backlight source, that is, a lens is added outside the packaged LED lamp bead to achieve The purpose of diverging the light emitted by the LED lamp bead, so that an additional lens needs to be added on the basis of the LED lamp bead, making the product thicker, and the lens is usually manually mounted on the LED lamp bead, which increases the The cost of manually pasting the lens is not conducive to cost reduction

Method used

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  • Backlight module, surface-mounted LED and packaging technology of surface-mounted LED
  • Backlight module, surface-mounted LED and packaging technology of surface-mounted LED
  • Backlight module, surface-mounted LED and packaging technology of surface-mounted LED

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Embodiment Construction

[0027] The present invention will be described in detail below with reference to the drawings and embodiments.

[0028] refer to figure 1 , In one embodiment of the SMD LED of the present invention, the SMD LED includes a bracket 11 and an LED chip 12 . Wherein, the bracket 11 is a flat bracket, and the LED chip 12 is fixed on the bracket 11 . A packaging lens 13 is also arranged on the bracket 11 . Preferably, the packaging lens 13 covers the LED chip 12 and is formed on the bracket 11 during the process of packaging the LED chip 12 on the bracket 11 . Of course, the encapsulation lens 13 may also be only partially disposed in the light emitting direction of the LED chip 12 .

[0029] Wherein, the process of packaging the LED chip 12 in the bracket 11 is to assemble the various components that make up the LED together to package to obtain a complete LED. In this embodiment, the packaging lens 13 is formed during the process of packaging the LED chip 12 on the bracket 11, ...

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Abstract

The invention discloses a backlight module, a surface-mounted LED and a packaging technology of the surface-mounted LED. The surface-mounted LED comprises a support and an LED chip fixed to the support, a packaging lens is arranged on the support and at least partially arranged in the light emitting direction of the LED chip, and the packaging lens is formed on the support in the process of packaging the LED chip on the support. Through the mode, production cost can be reduced, and lightening and thinning of the product are facilitated.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a backlight module, a chip-type LED and a packaging process thereof. Background technique [0002] Compared with the traditional cold cathode fluorescent lamp (CCFL) backlight module, the screen using the LED backlight module has the advantages of more uniform brightness, low power consumption, and thinner appearance. Therefore, more and more light source products use LED as the Backlight. LED backlight technology mainly includes direct-type backlight and edge-type backlight. [0003] Among them, the side-type backlight is mainly used in small-size backlights, such as the backlight of mobile phone screens. If the side-type backlight is applied to large-size backlights, such as larger-sized LCD TVs, the weight and cost of the light guide plate will increase. It increases with the increase of size, and its disadvantages of low luminance and poor uniformity become more and more obvio...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/58H01L33/54
CPCH01L2224/48091H01L33/483H01L33/58H01L2933/0033H01L2933/0058
Inventor 李漫铁屠孟龙谢玲
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