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Light sensing chip, camera and electronic product

A technology of photosensitive chips and cameras, applied in TV, electrical components, color TV, etc., can solve the problems of smaller pixel area of ​​photosensitive chips and higher and higher requirements for image quality, and achieve enhanced optical signal strength, reduced volume, and improved The effect of utilization

Inactive Publication Date: 2014-08-27
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it still cannot solve the problem that the pixel area of ​​the photosensitive chip becomes smaller but the image quality is required to be higher and higher.

Method used

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  • Light sensing chip, camera and electronic product
  • Light sensing chip, camera and electronic product
  • Light sensing chip, camera and electronic product

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] Such as figure 2 As shown, a photosensitive chip described in this embodiment includes a chip body 201. The chip body 201 has a light-receiving surface 202 for receiving light emitted from the lens direction to the chip body 201 and a backlight surface 203 opposite to the light-receiving surface 202. The surface 203 is coated with a reflective layer 204 capable of reflecting light emitted from the light-receiving surface through the chip body 201 back to the chip body 201 . The light-receiving surface 202 and the backlight surface 203 are arranged parallel to each other, so as to ensure that the trajectory of the light is the same when the light is emitted from the backlight surface 203, reflected by the reflective layer 204, and then injected into the backlight surface 203, so that the reflected light is on the chip body 201 The action point on the light receiving surface 202 is the same as that of the light incident on the light receiving surface 202 from the directi...

Embodiment 2

[0060] Such as image 3 , 4 As shown, a photosensitive chip described in this embodiment includes a chip body 301 having a light receiving surface 302 and a backlight surface 303 and a reflection device capable of reflecting light back to the chip body 301, wherein the reflection device is arranged on the backlight surface of the chip body 301 303 side. In this embodiment, the reflecting device is a layer of reflecting film 304. The chip body 301 and the reflecting film 304 have the same outline and corresponding dimensions. The connector 305 of the 304 film, the reflective film 304 is connected to the chip body 301 through the connector 305 and is tightly pasted on the backlight surface 303 of the chip body 301 .

Embodiment 3

[0062] Such as Figure 5 , 6 , 7, a camera described in this embodiment includes a lens 401, a lens holder 402, and a circuit board 405 arranged sequentially from top to bottom (wherein up, down, and up and down in subsequent descriptions all refer to Direction), a light hole 403 is opened in the middle of the lens holder 402, a filter 404 is arranged above the light hole 403 and between the lens 401 and the lens holder 402, and the line corresponding to the position of the light hole 403 A photosensitive chip is arranged on the board 405, and the photosensitive chip includes a chip body 406. The upper surface of the chip body 406 is a light-receiving surface 407, and the lower surface is a backlight surface 408. The backlight surface 408 of the chip body 406 is coated with The light emitted by the body 406 from the light receiving surface 407 is reflected back to the reflective layer 409 of the chip body 406 .

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Abstract

The invention discloses a light sensing chip, a camera and an electronic product. The camera and the electronic product respectively comprise the light sensing chip. The light sensing chip comprises a chip body and a reflection device arranged on one side, deviating from the light incidence plane, of the chip body, and the reflection device is used for reflecting light penetrating through the chip body so that the chip body can sense the light again. The reflection device is arranged on the shady face of the light sensing chip, and the light sensing chip carries out secondary light sensing by reflecting the light emitted by the light sensing chip back through the reflection device, so that the light signal intensity received by the light sensing chip is improved, and the light sensing efficiency is improved. According to the camera with the reflection device, the size of the light sensing chip is decreased, so that the camera is smaller in size, and the shooting effect is ensured as much as possible. As the camera smaller in size is adopted on the electronic product, the size of the electronic product can be decreased, and experience comfort level of customers and the attractiveness of the electronic product can be improved.

Description

technical field [0001] The invention relates to the field of photographing and imaging technologies, in particular to a photosensitive chip, a camera and electronic products. Background technique [0002] The camera is an indispensable input device in electronic products such as mobile phones and tablet computers. With the continuous improvement of users' requirements for product quality and comfort, making electronic products light and thin is the main development direction of electronic products in the market. , so it is the development trend of the camera to make the camera smaller without affecting the image quality of the camera. [0003] The camera mainly includes a lens, a photosensitive chip and a circuit board. The photosensitive chip is the main component of the camera. It is then converted into a digital signal by analog-to-digital conversion. The amount of light received by the photosensitive chip is an important factor affecting the image quality. As the size ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 王志
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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