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Manufacturing method of semiconductor device and adhesive film used in the manufacturing method of semiconductor device

A manufacturing method and adhesive film technology, applied in semiconductor/solid-state device manufacturing, adhesives, film/sheet-like adhesives, etc., can solve problems such as inability to peel off die-bonding sheets, inability to properly cut off chip-bonding sheets, etc., and achieve Effect of suppressing adhesion to the chip surface and reducing the amount of debris

Active Publication Date: 2016-11-30
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a result, the chips at the time of cutting the die-bonding sheet are fused with the die-bonding sheet, and the die-bonding sheet cannot be cut properly.
Especially when the chip is thin or the die-bonding sheet is thick, there is a high possibility that the die-bonding sheet cannot be properly cut.
Therefore, there is a problem that the die-bonding sheet cannot be peeled off from the dicing tape in the subsequent pick-up process.

Method used

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  • Manufacturing method of semiconductor device and adhesive film used in the manufacturing method of semiconductor device
  • Manufacturing method of semiconductor device and adhesive film used in the manufacturing method of semiconductor device
  • Manufacturing method of semiconductor device and adhesive film used in the manufacturing method of semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0155] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0156] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)

[0157] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 32 parts

[0158] (c) 34 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)

[0159] (d) 90 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)

[0160] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, an adhesive film A having a thickness of 25 μm in Example 1 was obtained.

Embodiment 2

[0162] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0163] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)

[0164] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 12 parts

[0165] (c) 13 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)

[0166] (d) 188 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)

[0167] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, the adhesive film B of Example 2 having a thickness of 25 μm was obtained.

Embodiment 3

[0169] The following (a) to (d) were dissolved in methyl ethyl ketone to obtain an adhesive composition solution having a concentration of 23.6% by weight.

[0170] (a) 100 parts of acrylate-based polymer mainly composed of ethyl acrylate-methyl methacrylate (manufactured by Negami Industry Co., Ltd., Parachrom W-197CM)

[0171] (b) Epoxy resin (made by JER Co., Ltd., Epicoat 1004) 21 parts

[0172] (c) 22 parts of phenolic resin (Milex XLC-4L manufactured by Mitsui Chemicals Co., Ltd.)

[0173] (d) 77 parts of spherical silica (manufactured by Admatex Co., Ltd., SO-25R)

[0174] This adhesive composition solution was coated on a release-treated film (release liner) composed of a polyethylene terephthalate film having a thickness of 50 μm after a silicone release treatment, and then heated at 130° C. Let dry for 2 minutes. Thus, an adhesive film C having a thickness of 25 μm in Example 3 was obtained.

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Abstract

An object of the present invention is to provide a method of manufacturing a semiconductor device capable of improving cutting reliability of an adhesive film and suppressing chip contamination caused by the adhesive film. The present invention provides a method for manufacturing a semiconductor device, comprising the following steps: after forming a groove (4S) on the surface of a semiconductor wafer (4), pasting a protective adhesive film (44), performing back grinding of the semiconductor wafer, and The process of exposing the groove from the back surface; the process of attaching the adhesive film to the back surface of the semiconductor wafer and then peeling off the protective adhesive film; and the process of cutting the adhesive film by irradiating a laser with a wavelength of 355 nm along the groove where the adhesive film was exposed ; The absorption coefficient of (a) wavelength 355nm of the adhesive film is 40cm ‑1 The above, (b) the tensile storage modulus at 50°C is 0.5 MPa to 20 MPa, and (c) the tensile storage modulus at 120°C is 0.3 MPa to 7 MPa, or 120°C The melt viscosity under the condition is above 2000Pa·s.

Description

technical field [0001] The present invention relates to a method of manufacturing a semiconductor device and an adhesive film used in the method of manufacturing the semiconductor device. Background technique [0002] Conventionally, silver paste has been used when adhering semiconductor chips to lead frames or electrode members in the manufacturing process of semiconductor devices. The adhesion process is performed by applying a paste-like adhesive on a die pad of a lead frame, etc., mounting a semiconductor chip thereon, and curing the paste-like adhesive layer. [0003] However, the slurry adhesive has large variations in coating amount, coating shape, etc. due to its viscosity behavior, deterioration, and the like. As a result, the thickness of the formed paste-like adhesive is not uniform, and thus the reliability of the adhesion strength of the semiconductor chip is poor. That is, when the coating amount of the paste-like adhesive is insufficient, the adhesive streng...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/301C09J7/00C09J11/04C09J133/04C09J161/06C09J163/00H01L21/52
Inventor 田中俊平宍户雄一郎大西谦司浅井文辉
Owner NITTO DENKO CORP
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