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Wafer adhering apparatus

A technology for pasting devices and wafers, which can be used in the fields of surface coating liquid devices, electrical components, semiconductor/solid-state device manufacturing, etc., and can solve problems such as hindering ultraviolet photopolymerization and long-term ultraviolet irradiation processes

Inactive Publication Date: 2014-10-01
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, since the outer periphery of the liquid resin is exposed to the air, there is a problem that oxygen in the air hinders the photopolymerization reaction of ultraviolet curing
In order to solve this problem, it is necessary to seal the surroundings of the table during ultraviolet irradiation and fill the environment near the table with nitrogen gas. However, since the air in the closed space must be replaced with nitrogen gas after sealing the surroundings of the table, the ultraviolet irradiation process takes a long time.

Method used

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Examples

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Embodiment Construction

[0028] In recent years, a wafer with a large diameter of 450 mm has been developed in order to increase the size of the chip and improve productivity. When the wafer is bonded to the sheet with the ultraviolet-curable liquid resin, the liquid resin spread on the lower surface of the wafer is irradiated with ultraviolet light in a state sandwiched between the wafer and the sheet. In this case, the entire periphery of the liquid resin is exposed to the air from the gap between the wafer and the sheet, and as the diameter of the wafer increases, the range of exposure of the liquid resin to the air expands.

[0029] In UV-curable liquid resins, the photopolymerization reaction is hindered by oxygen in the air when ultraviolet rays are irradiated, and tackiness remains on the air-contacting surface of the liquid resin. As a result, the range in which the liquid resin is exposed to the air increases due to the increase in the diameter of the wafer, so that the liquid resin cannot be...

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Abstract

The invention provides a wafer adhering apparatus, and the apparatus enables a wafer contacting with air and the periphery of liquid resin to form a nitrogen environment in a short time in a process of ultraviolet hardening. The apparatus (1) is provided with a platform part (23) which maintains a sheet material (2); a resin supply member (24) which supplies liquid resin (5) to the sheet material (2); a pressure member (25) which can maintain a wafer (W) in a mode of pressing the wafer (W) to the sheet material (2) above the platform part (23); and an ultraviolet irradiation member (28) which irradiates ultraviolet light to the platform part (23). The apparatus is formed in a mode that the pressure member (25) is provided with a plurality of injection ports (253) in a mode of surrounding the wafer (W) and nitrogen is injected from the injection ports (253).

Description

technical field [0001] The present invention relates to a wafer sticking device for sticking a semiconductor wafer to a sheet through a liquid resin in a wafer manufacturing process. Background technique [0002] In the wafer manufacturing process, for example, a cylindrical material such as silicon is sliced ​​with a wire saw to form a substrate-shaped wafer. In the sliced ​​wafer, undulations, warpage, etc. occur during dicing, but a liquid resin is applied to one surface to form a flat surface. A sheet that facilitates wafer handling is attached to the flat surface on which the liquid resin is applied, and the surface of the sheet is ground to form a flat thin plate. [0003] As a wafer sticking device for sticking a wafer to a sheet through a liquid resin, there is known a wafer sticking device that performs a series of operations from loading a pre-processed wafer to carrying out a processed wafer with a sheet (for example, refer to Patent No. Literature 1). In the w...

Claims

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Application Information

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IPC IPC(8): H01L21/31H01L21/67B05C11/00
CPCB05C11/1002H01L21/6715H01L21/6836
Inventor 小野贵司小野寺宽桑名一孝
Owner DISCO CORP