Cooling module

Abstract

The invention discloses a cooling module, which includes a centrifugal fan and a heat pipe. The centrifugal fan includes a housing, a heat dissipation fin array, a retaining wall, fan blades and a driving device. The housing has an axial air inlet, an axial air outlet and a radial air outlet, wherein the axial air outlet is located at the corner where the tongue of the housing is located. The cooling fin array is arranged on the inner wall of the radial air outlet. The retaining wall is located on the housing wall where the axial air outlet of the casing is located, and the retaining wall abuts against the inner wall of the housing of an electronic device to form a circulation channel for guiding the airflow output by the axial air outlet to flow through the cooling fins The array of fins corresponds to the area of ​​the shell wall and directs the flow back to the axial inlet. The driving device is fixed in the housing and used to drive the fan blades to rotate. One end of the heat pipe abuts against the heat dissipation fin array, wherein the retaining wall and the heat pipe are respectively located on two opposite sides of the heat dissipation fin array.

Description

technical field [0001] The invention relates to a heat dissipation module, and in particular to a heat dissipation module equipped with a centrifugal fan. Background technique [0002] At present, most notebook computers with high-speed computing performance use active heat dissipation modules in their housings. In other words, the heat dissipation module basically includes a centrifugal fan, a heat pipe, and a heat dissipation fin array. One end of the heat pipe is used to connect to a heat source that requires heat dissipation (such as a central processing unit), and the other end of the heat pipe is used to attach to the heat dissipation fin array for transferring heat to the heat fin array through the heat pipe. The heat dissipation fin array is assembled on the air outlet of the centrifugal fan. When the blades of the centrifugal fan rotate, the heat of the heat dissipation fin array is taken out of the notebook computer by the airflow from the air outlet. [0003] Ho...

AI Technical Summary

Problems solved by technology

The heat dissipation fin array of the heat dissipation module cannot effectively take away the heat due to its own thermal energy accumulation, which makes the temperature of the heat dissipation fin array rise, and the temperature of the adjacent casing surface also rises together, which is easy to cause consumers to use sometimes uncomfortable

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