Heat dissipation module

A heat dissipation module and heat source technology, which is applied in the direction of indirect heat exchangers, heat exchange equipment, heat exchanger types, etc., can solve the problems of deformation of the overall heat dissipation module, inability to combine components of the heat dissipation module precisely, and affecting heat dissipation performance of the heat dissipation module. , to achieve a tight joint effect

Pending Publication Date: 2021-12-17
春鸿电子科技(重庆)有限公司
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Problems solved by technology

[0004] However, when the existing heat dissipation modules are applied to a heat source, they often have to be fixed and installed by means of locking elements. During the process of locking each corner end of the heat dissipation module, the locking elements often cause serious deformation of the entire heat dissipation module. Unfavorable conditions not only make it difficult for the components of the heat dissipation module to be assembled precisely, for example, the heat dissipation module is not easy to be in close contact with the heat source, and the heat dissipation fins are easily peeled off or fall off, etc., which in turn affects the original heat dissipation performance of the heat dissipation module.

Method used

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Embodiment Construction

[0055] The embodiments of the present invention are described below through specific specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification, and can also be implemented through other different specific embodiments. or apply.

[0056] The heat dissipation module provided by the present invention can be installed in an electronic device such as a computer host or a server, and the interior of the heat dissipation module can be filled with a working medium (such as cooling liquid), and the working medium can absorb the heat generated by the heat source (such as a chip or an electronic component such as a memory). The generated heat energy, the heated working medium can be sent to the condensing device for cooling, and the cooled working medium can be transferred back to the cooling module for the next heat absorption and circulation flow.

[0057] see figure 1...

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Abstract

The invention provides a heat dissipation module. The heat dissipation module comprises a water cooling head with a shell and a frame body which is arranged on the shell and comprises two side walls and at least one first rib, the two side walls are located on the two sides of the shell respectively, and the first rib is used for providing anti-deformation force so as to prevent the heat dissipation module from being seriously deformed when the heat dissipation module is locked.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a heat dissipation module. Background technique [0002] In accordance with modern requirements, computers and various electronic devices have developed rapidly and their performance has been continuously improved, but in the process, heat dissipation problems brought about by high-performance hardware also follow. Generally speaking, computers and various electronic devices usually use heat dissipation components to dissipate heat. For example, heat dissipation paste or heat sinks are attached to the electronic components to be dissipated, so as to absorb and dissipate heat. However, the effect of this heat dissipation method is limited, so a heat dissipation module using a liquid cooling method has been developed. [0003] Existing cooling modules using liquid cooling generally use cooling liquid to absorb heat energy. For example, the cooling liquid is fluidly connected to the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCG01M3/16H05K7/20772H05K7/20254F28D2021/0028F28F3/12F28D9/0068
Inventor 陈建安陈建佑陈韦豪陈柏彰赖俊锜林昀逵
Owner 春鸿电子科技(重庆)有限公司
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