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Manufacturing method of nano-hybrid resin diamond wire

A technology of hybrid resin and diamond wire, which is applied in the manufacture of tools, stone processing equipment, fine working devices, etc., can solve the problem of decreased bonding strength between binder and core wire, large diameter of resin diamond wire, and high consumption of silicon raw materials, etc. problem, to achieve the effect of improving heat resistance, reliable product quality and fast production speed

Inactive Publication Date: 2016-07-27
HENAN XINDAXIN SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of the solvent selected by this process is high, and the coating of the bonding agent is thick, which will easily cause the bonding strength between the bonding agent and the core wire to decrease. The consumption of silicon raw materials is large and the production cost is high

Method used

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  • Manufacturing method of nano-hybrid resin diamond wire
  • Manufacturing method of nano-hybrid resin diamond wire
  • Manufacturing method of nano-hybrid resin diamond wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] The manufacturing method of the nano-hybrid resin diamond wire in this embodiment comprises the following steps:

[0028] (1) Preparation of resin mixture: 54wt% phenolic resole resin, 16wt% nickel-coated diamond powder (40wt% coating) and 10wt% nanofiller (copper nanofiber: alumina = 1:2) Place it in a container, add methanol 20wt% to adjust the viscosity of the resin mixture, make the diamond abrasive and nano fillers easy to disperse, then fully stir, mix evenly, dissolve the soluble phenolic resin in methanol, and stir and mix the diamond micropowder and nano fillers to obtain Paste liquid, poured into the coating mold; the normal temperature viscosity of the resin mixture is: 5.5Pa·S, the particle size of diamond powder: 3μm-20μm; the particle size of alumina: 1μm-10μm, the particle size of nano-copper fiber: 2nm ~50nm;

[0029] (2) Pre-curing: Clean and air-dry the surface of the 100μm steel wire busbar first, then evenly coat the obtained resin mixture on the bu...

Embodiment 2

[0032] The manufacturing method of the nano-hybrid resin diamond wire in this embodiment comprises the following steps:

[0033] (1) Preparation of resin mixture: 42wt% modified polyimide resin, 20wt% titanium-coated diamond powder and 12wt filler (nano silica: alumina: silicon carbide = 1:2:2) % is placed in the container, and add ethyl acetate 26wt% to adjust the viscosity of the resin mixture, so that the diamond abrasive and the nanofiller are easy to disperse, then fully stir, mix evenly, and the soluble modified polyimide resin is dissolved in methanol, and Stir and mix diamond micropowder and nano filler to obtain a paste liquid, pour it into the coating mold; the viscosity of the resin mixture at room temperature is: 3.5Pa·S, the particle size of diamond micropowder: 3μm~20μm; the particle size of alumina: 1μm~10μm; Particle size of silicon carbide: 1 μm ~ 15 μm; particle size of nano silicon dioxide: 2nm ~ 50nm;

[0034] (2) Pre-curing: Clean and air-dry the surface ...

Embodiment 3

[0037] The manufacturing method of the nano-hybrid resin diamond wire in this embodiment comprises the following steps:

[0038] (1) Preparation of resin mixture: 46wt% phenolic resole resin, 18wt% nickel-coated corundum and 9wt% filler (nano-copper fiber: nano-silica: alumina=1:1:4) were placed in the container , and add N,N-dimethylformamide 27wt% to adjust the viscosity of the resin mixture, so that the diamond abrasive and nano fillers are easy to disperse, then fully stir, mix evenly, dissolve the soluble phenolic resin in methanol, and stir to mix the diamond and nano fillers to obtain a paste liquid, which is poured into the coating mold; the viscosity of the resin mixture at room temperature is: 3.0Pa·S, the particle size of diamond powder: 3μm-20μm; the particle size of alumina: 1μm-10μm; nano-copper fiber and Silica particle size: 2nm~50nm;

[0039](2) Pre-curing: first clean and air-dry the surface of the 100μm steel wire core wire, then evenly coat the obtained re...

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Abstract

The invention belongs to the technical field of diamond wire manufacturing, and relates to a method for manufacturing resin diamond wire, in particular to a method for manufacturing a self-developed nano-hybrid resin diamond wire. The present invention uses 42~54wt% of resin binder, 16~20wt% of diamond abrasive, 9~12wt% of nanometer filler and 20~27wt% of organic solvent to prepare resin mixed solution, and then pre-cures and takes-up curing in sequence to obtain nano Finished hybrid resin diamond wire. The method of the present invention is low in production cost, fast in speed, and has the advantages of energy saving and environmental protection. In particular, the wear resistance, heat resistance and holding force of abrasive grains of the resin mixture used in the present invention are significantly improved, and the resin diamond wire is further improved. Excellent product quality, making it durable and reliable.

Description

technical field [0001] The invention belongs to the technical field of diamond wire manufacturing, and relates to a method for manufacturing resin diamond wire, in particular to a method for manufacturing a self-developed nano-hybrid resin diamond wire. Background technique [0002] At present, the cutting of silicon wafers in the solar energy industry is mainly based on the cutting of mortar materials driven by steel wires. However, there are many limitations in mortar cutting, such as slow speed, easy to cause environmental pollution, and difficulty in recycling polysilicon in waste residues. Therefore, new cutting methods have been studied at home and abroad, among which resin diamond wire and electroplated diamond wire are the mainstream research directions. However, only a small amount of electroplated diamond wires are used in squaring and cutting in my country, and resin diamond wires have not been used yet. [0003] The manufacturing process of the existing resin di...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B28D5/04
Inventor 申君来张志刚王红霞王超立孙毅徐元清辛玲高敏杰张孟雷
Owner HENAN XINDAXIN SCI & TECH