Cooling system for communication equipment

Abstract

Disclosed is a heat dissipation system of a communications system, so as to solve a heat dissipation problem of a large-power-consuming and compact communications device without changing a device layout. The present invention relates to communications technologies. The heat dissipation system of the present invention comprises: an air cooling module, a liquid cooling module matching a mounting position of the air cooling module, and a joint bracket fixed on a communications board. A rear end of the liquid cooling module is connected with an external water inlet pipe and a return pipe, a first liquid pipeline communicated with the water inlet pipe and a second liquid pipeline communicated with the return pipe are disposed in the liquid cooling module, a front end of the liquid cooling module is provided with a first joint communicated with the first liquid pipeline and a second joint communicated with the second liquid pipeline, a third joint communicated with a water supply pipe on the communications board and a fourth joint communicated with a water drain pipe on the communications board are mounted on the joint bracket, the first joint matches the third joint, and the second joint matches the fourth joint. The present invention is applied to perform heat dissipation on a communications device.

Description

technical field [0001] The invention relates to communication technology, in particular to a cooling system for communication equipment. Background technique [0002] With the rapid development of the communication industry and the increasing demand for information services, network operators need to purchase more and more equipment in order to meet the growing customer needs. However, due to the limitation of the installation space in the computer room, the density of communication equipment is getting higher and higher. , the size of the equipment is getting smaller and smaller, but the power of the equipment is getting higher and higher. Therefore, how to solve the heat dissipation problem of high power consumption and compact equipment has become a problem to be solved in the design of communication equipment. [0003] At present, communication equipment usually includes multiple communication boards, and each communication board is plugged into the slot provided on the ...

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Problems solved by technology

[0004] However, the existing liquid cooling system generally adopts the arrangement of hoses on the front panel of the single board, and the cooling of the communication equipment is realized through the circulation of liquid in the hoses, but this will affect the equipment routing and equipment structure.

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