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Card and card production method

一种制造方法、基板的技术，应用在机器使用的记录载体、支撑结构上的电路布置、其他印刷电路零部件等方向，能够解决加热、加压不充分、生产效率降低、长时间挤压等问题，达到提高外观品质的效果

Active Publication Date: 2014-11-12
DAI NIPPON PRINTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, in the outer area, gaps may be formed between the upper and lower core pieces, heating and pressing may be insufficient, and depressions such as scratches may be formed on the surface of the card, or marks on the outer periphery of the antenna may appear, causing problems in appearance.
In addition, in order to solve the above-mentioned problems, it is necessary to carry out extrusion for a long time, which causes a decrease in production efficiency.

Method used

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Examples

Experimental program
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no. 1 Embodiment approach

[0044] Hereinafter, a first embodiment of the present invention will be described with reference to the drawings and the like.

[0045] figure 1 It is a plan view and a cross-sectional view of the card 1 of the first embodiment.

[0046] figure 1 (a) is a plan view of the card 1 .

[0047] figure 1 (b) is a cross-sectional view illustrating the layer structure of the card 1 ( figure 1 (a) b-b sectional view) shows the state before joining each layer.

[0048] In the embodiments and drawings, a drawing in which the card surface and the like are viewed with the normal direction of the card surface as the vertical direction Z is referred to as a plan view. In addition, the long side direction of the card 1 in plan view is defined as the left-right direction X, and the short side direction is defined as the vertical direction Y. The shape in the top view is called the proper top view shape.

[0049] In addition, in each drawing, in order to clearly show the structure etc. of ...

no. 2 Embodiment approach

[0154] Next, a second embodiment of the present invention will be described.

[0155] In the description of the following embodiment and the drawings, the same reference numerals are attached to the parts that realize the same functions as those of the above-mentioned first embodiment, or the same reference numerals are assigned at the end, and repeated descriptions are appropriately omitted.

[0156] Figure 8 It is explanatory drawing of the layer structure of the card 201 of 2nd Embodiment.

[0157] Figure 9 It is explanatory drawing of the manufacturing process of the card 201 of 2nd Embodiment.

[0158] Figure 9 (a) is with Figure 4 (c) Corresponding figure.

[0159] Figure 9 (b) is with Figure 4 (d) Corresponding figure.

[0160] Figure 9 (c) is with Figure 5 (f) Corresponding figure.

[0161] Such as Figure 8 As shown, since the thickness of the IC chip 232 is thinner than that of the first embodiment, the card 201 does not include the upper spacer.

...

no. 3 Embodiment approach

[0167] Next, a third embodiment of the present invention will be described.

[0168] Figure 10 It is explanatory drawing of the layer structure and manufacturing process of the card 301 of 3rd Embodiment.

[0169] Such as Figure 10 As shown in (a), the module substrate 330 is only mounted with wiring patterns 333 and thin electronic components (not shown), and is not mounted with thick electronic components such as IC chips. Therefore, the upper spacer and the lower spacer are not required for the card 301 , and the lower layer 310 and the upper layer 350 are directly stacked on the module substrate 330 .

[0170] Even in this case, the thickness adjustment layers 311 and 351 of the card 301 can increase the surface pressure between the lower layer 310 and the upper layer 350 in the substrate outer region S301 .

[0171] Thus, the card 301 of this embodiment can improve the production efficiency similarly to the first embodiment.

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PUM

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Abstract

[Problem] To provide a card capable of improving external appearance, and a card production method. [Solution] A card (1) is provided with: a module substrate (30); a lower layer (10) and an upper layer (50) arranged above and below the module substrate (30), the layers having an outline larger than the outline of the module substrate (30); and thickness adjustment layers (11, 51) for adjusting the thickness in a substrate outward region (S1), the thickness adjustment layers being provided between the lower layer (10) and the upper layer (50) and to the substrate outward region (S1) further outward than the outline of the module substrate (30), and being provided by printing to at least one layer among the layers that form the card (1).

Description

technical field [0001] The present invention relates to a card with a substrate inside and a method of manufacturing the card. Background technique [0002] There is an IC card in the prior art, the antenna substrate is clamped with upper and lower iron chips, heated and pressurized, the outer area of ​​the iron chip larger than the antenna substrate is thermally welded, and the antenna substrate is sealed inside (for example, patent document 1 ). [0003] However, the thickness of the outer region is thinner than the thickness of the region where the antenna substrates are stacked by the thickness of the antenna substrate. Therefore, in the outer region, gaps may be formed between the upper and lower core pieces, insufficient heating and pressure may be applied, and depressions such as scratches may be formed on the card surface, or traces of the outer periphery of the antenna may appear, causing problems in appearance. Furthermore, in order to solve the above-mentioned p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06K19/077G06K19/07
CPCG06K19/07722Y10T428/24331Y10T428/24752Y10T156/10Y10T29/4913H05K1/181H05K7/02H05K13/04H05K2201/20
Inventor 鹤田和也小川达之助
Owner DAI NIPPON PRINTING CO LTD
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