39results about "Other printed circuit details" patented technology

An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

The printed board includes a slit portion and a first conductive member that is provided straddling the slit portion. In a state in which the printed board is attached to an apparatus to which one end of a second conductive member having an elastic force is connected, another end of the second conductive member contacts the first conductive member, and the another end of the second conductive member passes through the slit portion.

[Problem] To provide a card capable of improving external appearance, and a card production method. [Solution] A card (1) is provided with: a module substrate (30); a lower layer (10) and an upper layer (50) arranged above and below the module substrate (30), the layers having an outline larger than the outline of the module substrate (30); and thickness adjustment layers (11, 51) for adjusting the thickness in a substrate outward region (S1), the thickness adjustment layers being provided between the lower layer (10) and the upper layer (50) and to the substrate outward region (S1) further outward than the outline of the module substrate (30), and being provided by printing to at least one layer among the layers that form the card (1).

This invention relates to a method for producing an electrical system comprising a support (1) bearing on a first face at least one device; with the device comprising at least one electronic component (2) provided with at least one electrical connector (21, 22), with the method comprising: a step of setting in place of a cover (6) positioned above the component; said cover (6) comprising at least one passage (61, 62) according to a dimension in thickness of the cover (6) in such a way as to form an access space to the at least one electrical connector (21, 22), a step of forming a sealing seam (71) in such a way that the component is encapsulated in a sealed cavity (9) delimited by the first face of the support (1), the first face of the cover (6) and the sealing seam (7). The method comprises a step of filling with a conductive material of is at least one passage (61, 62) of the cover (6) in such a way as to establish an electrical continuity between the conductive material and the at least one electrical connector (21, 22), formant a tapping (81, 82) and in that the sealing seam (7) comprises a dielectric material.

An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

The invention discloses a circuit board and a manufacturing method thereof. The circuit board comprises a first signal transmission layer and a second signal transmission layer. The circuit board also comprises a plurality of first signal transmission units arranged on the first signal transmission layer; a plurality of second signal transmission units arranged on the second signal transmission layer and corresponding to the plurality of first signal transmission units; and edge connection units corresponding to the first signal transmission units, wherein corresponding first signal transmission units and second signal transmission units form electric connection through corresponding connection units; the connection units are divided into at least two rows to form at least two connection layers; in directions parallel with the connection layers, adjacent connection layers form an offset; in the directions perpendicular to the connection layers in the first signal transmission layer, adjacent connection layers are overlapped partially. According to the invention, the signal transmission quality of the circuit board is improved.

The invention discloses an internal layer monitoring structure of a multilayer printed circuit board. The lengthways laminated structure of a working sheet of the multilayer printed circuit board comprises an external layer and multiple internal layers; the plane layout of the working sheet of the multilayer printed circuit board is that multiple circuit board single sheets are arranged; a plurality of sheet-cutting holes are formed in the edge of the working sheet; the sheet-cutting holes are through holes which run through the internal layers and the external layer; the inner surface of each sheet-cutting hole is covered with a copper sheet; the external layer of the working sheet, which is located at the periphery of the sheet-cutting holes, is provided with an external copper ring; the external copper ring is connected with the copper sheet located in each sheet-cutting hole; each internal layer of the working sheet, which is located at the periphery of the sheet-cutting holes, is provided with an internal copper ring; each internal copper ring is connected with the copper sheet in each sheet-cutting hole; the width of each internal copper ring is the maximum acceptable value of the deviation of the internal layers. When internal layer monitoring is needed, the sheet-cutting holes are taken off and cut off by using a sheet punching machine; besides the conventional internal lay data monitoring, whether the internal layers are in poor alignment can be judged through observing whether the sheet-cutting holes are located in the internal copper rings.

In an electro-optical device, a flexible first wiring substrate and a flexible second wiring substrate, which are respectively coupled to a first terminal region and a second terminal region, extend while overlapping with each other, and a first mold material is provided between the first wiring substrate and the second wiring substrate. The second wiring substrate includes a base film having transmissivity, a wiring line provided at the base film, and a protective layer that covers the wiring line and is less transmissive than the base film. In the second wiring substrate, a light-transmission window in which the wiring line and the protective layer are not present in part is provided in a region thereof overlapping with the first mold material.