Dust-proof, antifouling and anti-static HDI flexible circuit board and processing technology thereof

Abstract

The invention discloses a dust-proof, antifouling and anti-static HDI flexible circuit board, which comprises a circuit board body, wherein one end of the circuit board body is a connector, and the other end is a golden finger; the circuit board body comprises a first anti-static PET protective film, a first covering film, a first conductive layer, a substrate, a second conductive layer, a second covering film and a second anti-static PET protective film; the substrate is arranged in the middle of the circuit board body, the first conductive layer is adhered to the upper side of the substrate by using a transparent adhesive, and the second conductive layer is adhered to the lower side of the substrate by using a transparent adhesive; the first conductive layer is provided with deposited and plated copper, and the covering films are arranged on the deposited and plated copper; the first anti-static PET protective film is adhered on the first covering film; and a blind hole penetrates the first conductive layer, the substrate and the second conductive layer in sequence. The anti-static PET protective films of the HDI flexible circuit board are made of a transparent and flexible material, can effectively adhere to the board surfaces without being in contact with external air, do not generate static electricity and dust, do not break down a chip of a circuit on the circuit board, and can achieve the dust-proof, antifouling and anti-static effects.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a dust-proof, anti-fouling, anti-static HDI flexible circuit board and a processing technology thereof. Background technique [0002] Flexible circuit board is also called "soft board", that is, FPC board. It is a printed circuit made of a flexible insulating substrate. Flexible circuits provide excellent electrical performance, can meet the design needs of smaller and higher density mounting, and also help reduce assembly processes and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. It can be bent, wound, and folded freely, and can withstand millions of dynamic bendings without damaging the wires. It can be arranged arbitrarily according to the spatial layout requirements, and can be moved and stretched in three-dimensional space, so as to achieve the integration of componen...

AI Technical Summary

Problems solved by technology

[0003] However, FPC boards are prone to electrostatic breakdown during the production process. At present, the solution to this problem mainly depends on the anti-static mat on the market, and this product relies on the addition of electrostatic agents and migrates to the surface of the mat, and then absorbs air water molecules to form Conductive path, so that it has an anti-static effect on the FPC board. At the same time, the product is easily affected by environmental factors such as air and humidity, and the electrostatic discharge effect is poor.

Especially in the dry northern climate area, the surface resistance value increases. As time goes by, the anti-static index decays faster and faster, resulting in unstable static discharge, which is easy to break down the circuit chip on the FPC board and cause equipment damage.

At the same time, the product cannot be transported with the FPC board, and cannot play a protective role at any time

The defects in the application link are very obvious, and it can no longer meet the requirements of the current FPC board development technology

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