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Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding

A technology for electronic devices and bonding devices, which can be used in electrical components, conveyor objects, semiconductor/solid-state device manufacturing, etc., and can solve problems such as limiting production capacity

Active Publication Date: 2014-11-19
ASM TECH SINGAPORE PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This sequential operation limits the throughput capacity of conventional die bonder 100

Method used

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  • Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding
  • Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding
  • Bonding apparatus having a plurality of rotary transfer arms for transferring electronic devices for bonding

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Embodiment Construction

[0012] figure 2 Shown is a schematic perspective view of a bonding device 200 in the form of a double-rotating bonding arm bonding system according to a preferred embodiment of the present invention. The bonding apparatus 200 includes: i) a single support device (shown as a movable wafer XY stage 26); ii) a die supply device (shown as a wafer 25 containing batches of dies), It is arranged on the wafer XY stage 26; iii) an ejection device (shown as a die ejection device 28, which contains ejection pins) for pushing the semiconductor die of the wafer 25; iv) first and second transport equipment (shown as first and second rotary transfer arms 14 and 16, which are respectively driven by first and second rotary bond heads 18, 20); and v) first and second transfer devices (shown as first and second substrate transfer devices 22 and 24 ) for transferring and supporting substrates 32 , 34 . Some examples of substrates 32 , 34 include lead frames for die bonding, and BGA (ball-grid ...

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PUM

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Abstract

Disclosed is a bonding apparatus, comprising: i) a supporting device for supporting a supply of electronic devices; ii) an ejecting device for ejecting an electronic device from the supply of electronic devices; iii) a plurality of delivery devices, each delivery device being for delivering a substrate for bonding the electronic devices thereto; and iv) a plurality of transfer devices, each transfer device having a rotary transfer arm operable to transfer the electronic devices from the supply of electronic devices at one or more pick locations to a respective one of the substrates for bonding thereto, upon the electronic devices being ejected by the ejecting device from the supply of electronic devices at the one or more pick locations. A method of bonding electronic devices to substrates is also disclosed.

Description

technical field [0001] The present invention relates to a bonding apparatus comprising a plurality of conveying devices for conveying devices such as semiconductor dies. Such bonding apparatus is particularly, but not exclusively, suitable for bonding semiconductor die to lead frames. Background technique [0002] figure 1 Illustrated is a conventional die bonder 100 comprising a single rotating transfer arm 114 driven by a rotating bond head 118 for supporting a supply of semiconductor dies A separate wafer XY stage 126 for wafer 128 and a separate work fixture XY stage 122 for supporting substrate 132 for large area die bonding. After the jaws of the rotary transfer arm 114 pick up the semiconductor die from the wafer 128 using a vacuum at the pick-up position 110, the rotary transfer arm 114 is rotated toward the substrate 132 to transfer the semiconductor die onto the substrate 132. has been drip-coated with epoxy. After the semiconductor die has been bonded to the s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/60
CPCB65G47/04H01L21/67144H01L24/75H01L2224/7565H01L2224/75753H01L2224/758
Inventor 林钜淦邓谚羲林永辉
Owner ASM TECH SINGAPORE PTE LTD
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