A crystal rod cutting system
A cutting system and ingot technology, applied in work accessories, fine work devices, stone processing equipment, etc., can solve the problems of easy slipping, accidents, complicated methods, etc., to save work time, improve production efficiency, simplify The effect of the production process
Active Publication Date: 2016-02-10
盐城创咏新能源投资有限公司
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Problems solved by technology
[0002] In industrial production, use a slicer to cut the ingot into wafers before packaging and leaving the factory; the common method is to first fix the ingot on the sliced crystal holder with colloid, and use a transport trolley to hold the crystal holder after the colloid is solidified , put it on the wire plane, start the wire plane to cut the ingot into wafers, turn off the instrument and lift the crystal holder, put the crystal holder together with the wafer in the glue removal pool for cleaning; this method is very complicated and needs to be glued Glue and glue removal, while the transport trolley is prone to slipping during the handling process, damaging the crystal bar, and even causing accidents
Method used
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[0013] exist Figure 1 to Figure 3 In the shown embodiment, it includes a wire plane 3 composed of metal cutting wires arranged equidistantly and in parallel; above the wire plane 3, there is a pair of movable splints perpendicular to the wire plane 3 1. There is a splint controller to adjust the opening and closing and moving up and down of the movable splint 1; on the inner wall of the pair of movable splints 1, there are limit ribs 11 that limit the axial displacement of the ingot; on the wire plane 3 Below, there is a movable support plate 4 parallel to the wire plane 3, and a row of grooves 41 corresponding to the wire plane 3 are arranged on the upper surface of the movable support plate 4; the movable support plate is controlled by the support plate The device is adjusted to move up and down and left and right; on both sides of the support plate, a pair of positioning plates with the same structure as the above-mentioned movable splint are installed; the inner walls of ...
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The invention relates to an improved crystal bar cutting system. The crystal bar cutting system comprises a metal wire plane formed by metal cutting wires which are arranged equidistantly in parallel. A pair of movable clamping plates perpendicular to the metal wire plane is arranged on the metal wire plane. A clamping plate controller is used for adjusting opening, closing and vertical movement of the movable clamping plates. The inner wall of each movable clamping plate is provided with limiting ridges for limiting axial displacement of a crystal bar. A movable supporting plate parallel to the metal wire plane is arranged under the metal wire plane. The two sides of the supporting plate are provided with a pair of locating plates with the same structure as the movable clamping plates. By the adoption of the crystal bar cutting system, the crystal bar can be cut into crystal plates without being fixed through colloid, so that the operation process is simplified, and the working efficiency is improved; meanwhile, the operation process that the crystal bar is conveyed to the metal wire plane is improved, and damage to the crystal bar is effectively reduced.
Description
technical field [0001] The invention relates to a slicing device, in particular to a crystal rod cutting system. Background technique [0002] In industrial production, use a slicer to cut the ingot into wafers before packaging and leaving the factory; the common method is to first fix the ingot on the sliced crystal holder with colloid, and use a transport trolley to hold the crystal holder after the colloid is solidified , put it on the wire plane, start the wire plane to cut the ingot into wafers, turn off the instrument and lift the crystal holder, put the crystal holder together with the wafer in the glue removal pool for cleaning; this method is very complicated and needs to be glued Glue and glue removal, while the transport trolley is prone to slipping during the handling process, damaging the ingot, and even causing accidents. Contents of the invention [0003] In view of the above problems, the object of the present invention is to provide an improved ingot cu...
Claims
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IPC IPC(8): B28D5/04B28D7/00
Inventor 马志明
Owner 盐城创咏新能源投资有限公司