Check patentability & draft patents in minutes with Patsnap Eureka AI!

Method of making plates

A technology for plates and substrates, which is applied in the field of manufacturing conductive plates and can solve problems such as difficulty in obtaining plastic films.

Active Publication Date: 2017-08-15
AW品牌有限公司
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Furthermore, the use of sheets or paper for printed electronics enables very large printing surfaces, which are more difficult to obtain with plastic films

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method of making plates
  • Method of making plates
  • Method of making plates

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0225] Embodiment 1: According to steps a / to c / of the method of the present invention, a multilayer structure and a sheet are completed.

[0226] Several multilayer structures were completed by repeating step a / of the method according to the invention, using paper substrates (Bristol board and Maine gloss from the company Arjowiggins).

[0227] Tests were performed to determine the most suitable adhesive for carrying out step b / of the method. The adhesive used must be capable of securing the paper on the layer with respect to the multilayer structure to an extent sufficient to prevent detachment of the adhesive from this layer during removal of the plastic film in step c / .

[0228] We have tested three types of adhesives: a / solvent-containing two-component PU adhesive (reference from Rexor's AD1048), b / solvent-containing one-component PU adhesive (reference from COIM's NC320), And c / solvent-free one-component PU adhesive (the reference is SF2930 from COIM Company).

[0229...

Embodiment 2

[0230] Embodiment 2: Preparation of a plate comprising a gold thin film, the gold thin film is formed on the base layer of the plate in situ (the method comprising step d1 / ).

[0231] The deposition of the gold film on the base layer of the plate produced by the method according to the invention was carried out in vacuum with a DEP280 machine. This machine can vacuum deposit many metals such as titanium, copper or gold (gold). In this case, pure metal is deposited on the base layer of the sheet. The sheet was previously placed in an oven for degassing (100°C). Thereby, the pressure is reduced. The pressure in the enclosure is at 9.5.10 -7 mbar (over about 14 minutes) and 8.10 -7 mbar (over about 25 minutes). Pre-spray for 120 seconds first. Then continue spraying for 375 seconds. The final gold deposited on the plate was 30nm thick. Up to 3 plates to be processed can be placed in the machine at the same time.

Embodiment 3

[0232] Example 3: A photoetching step is performed using a sheet coated with a metal layer (such as that produced in Example 2).

[0233] A positive resin (positive resin) with a thickness of 1.8 μm (representing about 2 mL of resin) is deposited on a metal-coated plate sample (size 11*11 cm, such as Example 2) by spin coating at a speed of 3000 rpm of) on. This operation lasts about 15 seconds. The difference between a positive resin and a negative resin is caused during the development of multiple regions exposed to photolithography rays (illumination). In the first case, the exposed areas disappear during development; in the second case, it is the unexposed areas that disappear.

[0234] The sheet was placed in an oven to crosslink the resin. This was done at a temperature of 115°C and over a period of approximately 5 minutes. For the illumination step, a quartz mask is placed on the plate, the mask contains a pattern, and the rays are intended to pass through areas wit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
diameteraaaaaaaaaa
thicknessaaaaaaaaaa
surface roughnessaaaaaaaaaa
Login to View More

Abstract

The present invention relates to a method for producing a conductive sheet comprising a substrate, in particular made of paper, and a conductive layer, said method comprising the following steps: a / preparing a multilayer structure comprising a plastic film, a release coating and a base layer with the release coating sandwiched between the plastic film and the base layer, b / cross-laminating the multilayer structure and the substrate, and c / removing the plastic film and the release coating from the base layer layer, characterized in that the base layer is a layer of conductive material or is covered with a conductive layer through another step consisting of: d1 / depositing a conductive film on the base layer; or d2 / with at least one electrical property The substrate layer is ink-printed, and the substrate layer is a printable layer with an adhesive substrate having a proportion of the adhesive substrate greater than 15% (by dry weight) relative to the total dry weight of the layer.

Description

technical field [0001] The invention relates to a method of manufacturing an electrically conductive sheet comprising a substrate, in particular made of paper, and an electrically conductive layer. The invention further relates to a method of manufacturing a plate, one side of which comprises a region which is smoother than the remainder of the side, which region comprises a surface extending on a smaller surface than said side surface and which is a conductive layer or is intended to be conductive. Smooth outer layer of layer overlay. These sheets are particularly suitable, but not limited to, applications for electronic devices, such as printed electronics. Background technique [0002] It has been proposed to fabricate sheets for printed electronics using a method comprising the steps of: preparing a multilayer structure cross-laminated with the multilayer structure comprising a plastic film, a printable layer, and the substrate. A release layer is inserted between the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): D21H27/00H05K3/00B32B29/06B41M1/22H05K1/16H05K3/20H05K1/09H05K1/03
CPCB32B29/06B41M1/22D21H27/00H05K1/16H05K3/207H05K1/0386Y10T428/24802H05K3/02H05K3/027H05K3/381
Inventor 盖尔·帝普雷斯尚马利·佛
Owner AW品牌有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com