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Light emitter components and methods having improved electrical contacts

A technology for light emitters and electrical contacts, applied in electrical components, electrical solid state devices, components of lighting devices, etc., can solve problems such as increased processing time and cost

Active Publication Date: 2014-12-10
CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Embedding the electrical contacts in the submount and / or electrically connecting the contacts inside the submount results in increased processing time and cost for the assembly

Method used

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  • Light emitter components and methods having improved electrical contacts
  • Light emitter components and methods having improved electrical contacts
  • Light emitter components and methods having improved electrical contacts

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Embodiment Construction

[0016] The subject matter disclosed herein relates to light emitter assemblies and methods, such as light emitting diode (LED) assemblies, with improved performance, ease of manufacture, cost savings, and improved electrical contacts. In one aspect, a novel surface mount device (SMD) assembly is provided. The assembly may advantageously include novel electrical contacts utilizing back or side electrical contacts or upper and lower contacts that connect to external "leads". In particular, the back or side contacts may be provided on the outside of the abutment (eg along a portion of the outer side). The side contacts may be plated or created by exposing through-holes or vias (eg, by sawing or trimming through-holes or vias). Assemblies described herein can include non-metallic submount materials that are substantially transparent and substantially non-absorbing light emitted by one or more LED chips. Reference will now be made in detail to possible aspects or implementations ...

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Abstract

Light emitter components and methods having improved electrical contacts and related methods are disclosed. In one embodiment, a light emitter component can include a submount, at least one light emitter chip on the submount, and at least one electrical contact disposed along portions of at least three external surfaces of the submount. The at least one electrical contact can be electrically connected to the at least one light emitter chip.

Description

[0001] Cross References to Related Applications [0002] This application is related to and claims priority from U.S. Provisional Patent Application No. 61 / 618,327, filed March 30, 2012, and U.S. Provisional Patent Application No. 61 / 642,995, filed May 4, 2012. This application is also related to and claims priority from US Patent Application Serial No. 13 / 800,260, filed March 13, 2013. The entire contents of each of these references are hereby incorporated by reference. technical field [0003] The subject matter disclosed herein relates generally to light emitter assemblies and methods. More particularly, the subject matter disclosed herein relates to light emitting diode (LED) assemblies and methods having improved electrical contacts configured to extend over outer portions of a submount of the assembly. Background technique [0004] Light-emitting diodes (LEDs), or LED chips, are solid-state components that convert electrical energy into light. LED chips can be utili...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/62H01L33/48
CPCF21V19/001H01L33/486H01L2224/48091H01L2224/73265F21V23/06H01L33/62H01L2924/12041H01L24/32H01L33/0095H01L2933/0066H01L2924/15787Y10T29/49165Y10T29/49155H01L2924/00014H01L2924/00
Inventor 杰西·科林·赖尔策克勒斯托弗·P·胡赛尔
Owner CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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