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A method and server for realizing distributed heat dissipation

A server and distributed technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve problems such as poor compatibility and maintainability, affect the continuity of system work, improve server performance, etc., to achieve flexibility Expanding and ensuring the effect of cooling performance

Active Publication Date: 2017-12-29
INSPUR BEIJING ELECTRONICS INFORMATION IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the existing server system has a single configuration, poor compatibility and maintainability, and it is impossible to improve server performance by replacing some modules
[0006] The existing server system cannot flexibly change and upgrade the system configuration to improve system performance. When it is necessary to improve the performance of the application server, it is often necessary to replace the old equipment with a new server. The cost of the equipment is high, and the introduction of a new server requires The data migration and maintenance of the original server will increase the cost and affect the continuity of the system work

Method used

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  • A method and server for realizing distributed heat dissipation
  • A method and server for realizing distributed heat dissipation
  • A method and server for realizing distributed heat dissipation

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Embodiment Construction

[0030] image 3 The flow chart of the method for realizing distributed cooling for the present invention, as image 3 shown, including:

[0031] Step 300 : Determine the windage resistance threshold and airflow threshold per unit thickness corresponding to different functional modules in the server, and classify the functional modules that meet the windage resistance threshold and airflow threshold of each functional module into corresponding modules.

[0032] It should be noted that the corresponding thresholds of wind resistance and air volume per unit thickness of each functional module are ranges of empirical values ​​of wind resistance and air volume for normal operation of server functional modules determined by those skilled in the art during the working process. In the existing method, the design of the fan module is only performed on the modules composed of identical functional modules, and the analysis and determination of the air volume and wind resistance are not ...

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Abstract

The invention discloses a method for realizing distributed heat dissipation and a server, including: determining the wind resistance threshold and the air volume threshold corresponding to each functional module in the server, and satisfying the functions of the wind resistance threshold and the air volume threshold of each functional module The modules are classified into the corresponding modules; when adding, deleting or replacing the functional modules in the module, adjust the air resistance and air volume of the added, deleted or replaced functional modules so that the fan module can meet the unit thickness of the functional module when working. Requirements for wind resistance threshold and air volume threshold. The present invention realizes the unified arrangement of the server modules by determining the air resistance and air volume thresholds per unit thickness of each functional module. When adjusting the modules, the fan modules can be used for each The module provides a certain threshold of air volume and wind resistance, which ensures the heat dissipation performance of the server and the flexible expansion of the server on the existing structure.

Description

technical field [0001] The invention relates to the field of computer heat dissipation, in particular to a method for distributed heat dissipation of a large server and the server. Background technique [0002] Server, also known as server. The server is used in the network environment to listen to the service requests submitted by other computers (clients) on the network and provide corresponding services. In large-scale server applications, in order to achieve greater processing capacity and faster computing speed, it is often necessary to integrate and interconnect multiple subsystems, such as interconnecting multiple computing units with multiple storage units, as well as networks and management units. It can be used together to achieve computing performance that is far beyond the reach of a single server. While high-density subsystem interconnection brings high-performance computing capabilities, it is usually accompanied by high power consumption and high heat genera...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/20
Inventor 苏丽尹宏伟
Owner INSPUR BEIJING ELECTRONICS INFORMATION IND
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