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Dual-interface smart card and its manufacturing method

A dual-interface smart card and card base technology, which is applied to record carriers used in machines, instruments, computer components, etc., can solve problems that affect the conduction performance of chips and antennas, reduce the life of milling cutters, and disconnection of milling slots, etc., to achieve Realize mass production, simplify the production process, and prolong the practical life

Active Publication Date: 2018-01-26
SHANGHAI ORIENTAL MAGNETIC CARD ENG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The disadvantages of the direct method are: first, it is welded after drawing the wire manually, and the production efficiency is very low; second, the inspection of the welding quality cannot be 100%, and the reliability of the product is very poor; third, the wire is broken or Wire damage, resulting in a very low yield of finished cards
[0004] The indirect defects are: first, the chip and the antenna are connected through the copper sheet, and the copper sheet is placed at both ends of the antenna and the copper sheet and the antenna are welded first, so the reliability is relatively poor; second, an additional Copper sheet cost; thirdly, there is no anti-oxidation protective layer on the surface of the copper sheet. After high temperature, the oxidation of the copper sheet leads to a decrease in the electrical conductivity. The service life is greatly reduced, which increases the frequency of milling cutter replacement and indirectly reduces the efficiency; fourth, the welding quality of the copper sheet and the antenna directly affects the conduction performance of the subsequent chip and the antenna, and some products with weak soldering will cause Potential risks such as functional failure and poor reliability
[0005] With the increasing demand for dual-interface smart cards, the development of application scope, and the increase in the reliability requirements of products, the products produced by the existing technology cannot meet the needs of customers.

Method used

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  • Dual-interface smart card and its manufacturing method
  • Dual-interface smart card and its manufacturing method
  • Dual-interface smart card and its manufacturing method

Examples

Experimental program
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Effect test

Embodiment approach 1

[0024] Such as figure 1 , figure 2 and image 3 As shown, the main body of the dual-interface smart card in the present invention is a card base 1, and the card base 1 can be a PVC (Polyvinylchloride, polyvinyl chloride) base material, and the middle part of an antenna 8 is implanted at the edge of the card base 1 The coil 2 is wound. The two free ends of the antenna 8 extend into the coil 2 and are wound into two pads 3. These two pads 3 are also embedded in the card base 1. In order to adapt to different products, two They can be placed up and down, or left and right (in this figure, they are placed left and right). The pad 3 is composed of a hidden area 4 and a contact area 5. The hidden area 4 is hidden inside the card base 1, and the contact area 4 is located on the step 7 of the card base. On the surface, the card base 1 between the two pads 3 is provided with a groove 6, and the upper surface of the hidden area 4, the contact area 5, the coil 2 and the upper surface ...

Embodiment approach 2

[0029] This embodiment provides a method for making a dual-interface smart card in Embodiment 1:

[0030] First, the middle part of an antenna 8 is wound around the edge of the card base 1 to form a coil 2, and the two free ends are wound into two pads 3 with a hidden area 4 and a contact area 5, and the coil 2 and the welding pad are welded together. The discs 3 are implanted inside the card base 1;

[0031] Secondly, the card base material above the contact area 5 of the two pads 3 is milled off to form a card base step 7, and the protective layer on the contact area 5 is milled off to ensure that the upper surface of the card base step 7, the upper surface of the contact area 5, The hidden area 4 and the coil 2 are in the same plane, and at the same time, a groove 6 is milled on the card base 1 between the two pads 3 (also can be said to be two contact areas 5); when in use, the coil 2 passes through two The contact region 5 is connected to the chip.

[0032] This impleme...

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PUM

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Abstract

The invention relates to the production field of double-interface smart cards, and discloses a double-interface smart card and a production method thereof. The double-interface smart card is composed of a card base and an antenna. The middle of antenna is wound into a coil to be positioned in the edge of the card base. Two free ends of the antenna are wound into two bonding pads. Each of the bonding pads is composed of a hiding area and a contacting area. A groove is formed in the card base between the bonding pads. The two contacting areas are positioned on card base steps on two sides of the groove. The two hiding areas are positioned in the card base. The upper surfaces of the coil, the hiding areas and the contacting areas are positioned on the same plane with the upper surfaces of the card base steps. The coil is connected with a chip through the two contacting areas. Compared with the prior art, the double-interface smart card and the production method thereof have the advantages that product production cost is reduced, production process is simplified, production efficiency is improved, product rejection rate is reduced, and mass production of the double-interface smart card is realized.

Description

technical field [0001] The invention relates to the field of smart card production, in particular to a dual-interface smart card and a production method thereof. Background technique [0002] At present, there are two production processes for dual-interface smart cards, one is direct and the other is indirect. [0003] The disadvantages of the direct method are: first, it is welded after drawing the wire manually, and the production efficiency is very low; second, the inspection of the welding quality cannot be 100%, and the reliability of the product is very poor; third, the wire is broken or Wire damage, resulting in a very low yield of finished cards. [0004] The indirect defects are: first, the chip and the antenna are connected through the copper sheet, and the copper sheet is placed at both ends of the antenna and the copper sheet and the antenna are welded first, so the reliability is relatively poor; second, an additional Copper sheet cost; thirdly, there is no an...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
Inventor 李晓东
Owner SHANGHAI ORIENTAL MAGNETIC CARD ENG