Dual-interface smart card and its manufacturing method
A dual-interface smart card and card base technology, which is applied to record carriers used in machines, instruments, computer components, etc., can solve problems that affect the conduction performance of chips and antennas, reduce the life of milling cutters, and disconnection of milling slots, etc., to achieve Realize mass production, simplify the production process, and prolong the practical life
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Embodiment approach 1
[0024] Such as figure 1 , figure 2 and image 3 As shown, the main body of the dual-interface smart card in the present invention is a card base 1, and the card base 1 can be a PVC (Polyvinylchloride, polyvinyl chloride) base material, and the middle part of an antenna 8 is implanted at the edge of the card base 1 The coil 2 is wound. The two free ends of the antenna 8 extend into the coil 2 and are wound into two pads 3. These two pads 3 are also embedded in the card base 1. In order to adapt to different products, two They can be placed up and down, or left and right (in this figure, they are placed left and right). The pad 3 is composed of a hidden area 4 and a contact area 5. The hidden area 4 is hidden inside the card base 1, and the contact area 4 is located on the step 7 of the card base. On the surface, the card base 1 between the two pads 3 is provided with a groove 6, and the upper surface of the hidden area 4, the contact area 5, the coil 2 and the upper surface ...
Embodiment approach 2
[0029] This embodiment provides a method for making a dual-interface smart card in Embodiment 1:
[0030] First, the middle part of an antenna 8 is wound around the edge of the card base 1 to form a coil 2, and the two free ends are wound into two pads 3 with a hidden area 4 and a contact area 5, and the coil 2 and the welding pad are welded together. The discs 3 are implanted inside the card base 1;
[0031] Secondly, the card base material above the contact area 5 of the two pads 3 is milled off to form a card base step 7, and the protective layer on the contact area 5 is milled off to ensure that the upper surface of the card base step 7, the upper surface of the contact area 5, The hidden area 4 and the coil 2 are in the same plane, and at the same time, a groove 6 is milled on the card base 1 between the two pads 3 (also can be said to be two contact areas 5); when in use, the coil 2 passes through two The contact region 5 is connected to the chip.
[0032] This impleme...
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