A substrate bonding clamping positioning device

Abstract

The invention discloses a clamping and positioning device for substrate adhesion. The clamping and positioning device comprises a base (1) and a pressure plate (7), the base (1) is used for bearing a metal shell (4), and the pressure plate (7) is used for pressurizing a substrate (6). Double-row outer pins (5) of the metal shell (4) are downwardly distributed on two sides of the base (1), positioning columns (2) are arranged at the top of the base (1), and the face of the pressure plate is provided with positioning holes (8) matched with the positioning columns and further provided with a group of pressure heads (9) pressing the top face of the substrate. Surfaces of the positioning columns are provided with external threads, an adjusting nut (11) in threaded fit with each positioning column (2) sleeves the corresponding positioning column (2), and a spring (12) sleeves each positioning column (2) between the corresponding adjusting nut (11) and the pressure plate (7). Due to the facts that the metal shell is arranged on the base and the pressure plate is limited by cooperation of the positioning columns and the positioning holes, relative displacement between the substrate and the metal shell during adhesion can be avoided, and influences on the pins are avoided; by the aid of the adjusting nuts, pressure applied to the substrate by the pressure plate can be adjusted so as to adjust adhesion pressure, and adhesion strength between the substrate and the metal shell can be guaranteed.

Description

Technical field [0001] The invention relates to the field of electronic product manufacturing, in particular to a bonding, clamping and positioning device for a substrate and a shell in a microelectronic product. Background technique [0002] It is well-known that the substrate bonding process refers to the use of specific bonding materials to firmly connect the substrate and the metal shell base to achieve the purpose of high-reliability interconnection assembly. It is one of the basic assembly processes of microelectronic products. . In order to ensure the tightness and firmness of the substrate bonding and interconnection, it is generally necessary to apply a fixed pressure between the substrate and the shell during the bonding and curing process to achieve a smooth, uniform, and void-free bonding interface after curing. Reliability requirements. At present, pressure is generally applied to the substrate and the metal shell through the clamping method of spring clips to comp...

AI Technical Summary

Problems solved by technology

At present, the clamping method of spring clips is generally used to apply pressure to the substrate and the metal casing to complete the bonding, but this clamping method will cause relative friction between the substrate and the metal casing during the curing process of the adhesive. Offset, resulting in inconsistent lengths of the outer pins bonded between the substrate and the metal shell lead posts, and when the outer pins are too long, it is easy to fall over. In addition, the spring tightness of the spring clip will change with the use cycle Increase and change, resulting in inconsistent bonding pressure, seriously affecting the bonding strength of the adhesive after curing

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