Transfer tool, connection part of transfer tool and picker of transfer tool

Abstract

The present invention relates to a transferring tool and, more particularly, to a transferring tool, and a linking member and a picker of the transferring tool, the transferring tool comprising a picker for picking up a device by vacuum pressure. Disclosed is a transferring tool comprising a pitch adjustment part for adjusting an interval among a plurality of pickers, wherein the pitch adjustment part comprises: a main support body installed on a structure; a plurality of linking parts comprising a pair of linking members which are installed on the main support body and are cross-coupled in an X shape, each support member being coupled to the cross-coupled portion, and the plurality of linking parts being arranged in a row corresponding to the plurality of support members; and a plurality of coupling pins for rotatably coupling the ends of the linking members of the plurality of linking parts with the ends of adjacent linking members of the plurality of linking parts, wherein the linking member is metallic, has a first coupling hole, rotatably coupled to the linking member cross-coupled in the X shape, formed in the center thereof, and has second coupling holes formed on both ends thereof, into which the coupling pins are inserted so as to be rotatably coupled to the adjacent linking members.

Description

technical field [0001] The present invention relates to a transfer tool, and more particularly, to a transfer tool including a picker that picks up components by vacuum pressure, a connecting part of the transfer tool, and the picker of the transfer tool. Background technique [0002] After the semiconductor device (hereinafter referred to as 'device') has completed the assembly process, various inspections such as electrical characteristics, thermal or pressure-related reliability tests are carried out by the semiconductor device inspection device. According to the types of components such as memory components, CPU, GPU and other non-memory components, LED components, and solar components, the inspection of components is divided into room temperature inspections performed in room temperature environments, and heating inspections performed in high temperature environments, etc. kind of inspection. [0003] Moreover, the inspection of the components is usually carried out af...

AI Technical Summary

Problems solved by technology

[0013] However, as the interval between multiple pickers according to the pitch adjustment section, that is, regarding the pitch adjustment, as the size of the components becomes smaller and the processing speed increases, the conventional transfer tool requires a more rapid and precise pitch Adjustment

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