Patterned cp test setup for cmos image sensor products

Abstract

The invention discloses a patterned CP testing device for a CMOS image sensor product, which comprises a probe card, on which pattern glass is installed, and a test pattern and an alignment mark are arranged on the pattern glass. The two sides of the probe card are respectively equipped with moving card slots, and the two ends of the moving card slots are respectively equipped with stepping motors. The shafts of the two stepping motors are arranged opposite to each other. The guide rail, the graphic glass is placed on the round roller guide rail. Chip defects can be found more accurately and the efficiency of testing can be improved.

Description

technical field [0001] The invention relates to a WAFER testing device, in particular to a patterned CP testing device for CMOS image sensor products. Background technique [0002] The WAFER test (CP test) of CMOS image sensor products is a necessary test item, and it is required to ensure the accuracy of the test. [0003] The testing methods in the prior art have low accuracy and low testing efficiency. Contents of the invention [0004] The object of the present invention is to provide a patterned CP testing device for CMOS image sensor products with high accuracy and high testing efficiency. [0005] The purpose of the present invention is achieved through the following technical solutions: [0006] The patterned CP test device for CMOS image sensor products of the present invention includes a probe card, on which a pattern glass is installed, and a test pattern and an alignment mark are arranged on the pattern glass. [0007] As can be seen from the technical solut...

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Problems solved by technology

[0003] The test methods in the prior art have low accuracy and low test efficiency

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