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Manufacturing method of multi-layer soft-and-hard-plate combined printed board with impedance requirement

A production method and technology of printed boards, which are applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve the problems of rising enterprise costs, low profit margins, and high production costs, and ensure quality and reliability. Good bending performance, ensuring the effect of coincidence

Inactive Publication Date: 2015-01-28
双鸿电子(惠州)有限公司
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AI Technical Summary

Problems solved by technology

At present, printed boards that combine multi-layer soft boards and hard boards and have impedance requirements have very strict requirements on flexibility and reliability. The core production technology is monopolized by Japan, South Korea, Europe and other countries. Domestic FPC manufacturers produce this type of board. The technology

Method used

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Embodiment Construction

[0021] In order to facilitate those skilled in the art to understand the present invention, the present invention will be further described in detail below in conjunction with specific examples.

[0022] The manufacturing method of the printed board combining flexible and rigid boards and having impedance requirements according to the present invention, the specific process is as follows:

[0023] (1) Fabricate the circuit of the inner flexible board, and press the covering film on both sides of the prepared soft board. This step specifically includes: drilling holes after material cutting for automatic exposure machine alignment; CCD automatically recognizes alignment and transfers graphics. In this step, it is necessary to ensure that the coincidence tolerance of the two sides of the board is less than ±0.02mm; develop on the DES line , Etching, and finally make the inner soft board circuit.

[0024] After the inner flexible circuit is fabricated, it needs to be inspect...

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PUM

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Abstract

The invention relates to a manufacturing method of a multi-layer soft-and-hard-plate combined printed board with an impedance requirement. The manufacturing method comprises the steps that an inner soft plate circuit is manufactured, and cover films are pressed on the two faces of a manufactured soft plate; PP sheet processing and copper foil and soft plate surface processing are carried out; the soft plate, the processed PP sheet and the copper foil are overlaid, and a false attaching machine is used for carrying out pre-pressing locating; a press-fit machine is used for pressing the soft plate, the processed PP sheet and the copper foil; an outer circuit is manufactured, and outer copper foil where circuits do not need to be manufactured is removed through etching. By means of the manufacturing method, the product yield can be greatly improved through process control and can reach more than 90%, and the product rejection rate is lowered to about 8%.

Description

technical field [0001] The invention relates to the technical field of FPC flexible boards, in particular to a method for manufacturing a printed board with a combination of soft and hard boards and impedance requirements. Background technique [0002] At present, electronic products are getting smaller and smaller, and more and more electronic products need to use printed boards that combine multi-layer soft boards and hard boards and have impedance requirements, especially in the field of communication. At present, printed boards that combine multi-layer soft boards and hard boards and have impedance requirements have very strict requirements on flexibility and reliability. The core production technology is monopolized by Japan, South Korea, Europe and other countries. Domestic FPC manufacturers produce this type of board. The technology is immature, the quality is unstable, the production pass rate is only about 50%, the scrap rate is over 30%, the production cost is very...

Claims

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Application Information

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IPC IPC(8): H05K3/46
CPCH05K3/4611
Inventor 陈江波梁胜辉
Owner 双鸿电子(惠州)有限公司
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