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Heat exchange device and semiconductor refrigerator with heat exchange device

A heat exchange device and semiconductor technology, which is applied in household refrigeration devices, household appliances, lighting and heating equipment, etc., can solve the problem of unsatisfactory heat exchange efficiency of heat exchange devices, limit the widespread use of semiconductor refrigerators, reduce the mechanical strength of refrigerant boxes, etc. problems, to achieve the effect of reducing adverse effects, reducing possibilities, and prolonging service life

Active Publication Date: 2015-02-04
HAIER GRP CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the heat exchange device is working, the interior of the refrigerant tank is usually in a high-pressure state, and too many openings will easily cause refrigerant leakage on the one hand; on the other hand, it will easily reduce the mechanical strength of the refrigerant tank
In addition, the heat exchange efficiency of the heat exchange device of existing semiconductor refrigerators is not ideal, which limits the widespread use of semiconductor refrigerators

Method used

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  • Heat exchange device and semiconductor refrigerator with heat exchange device
  • Heat exchange device and semiconductor refrigerator with heat exchange device
  • Heat exchange device and semiconductor refrigerator with heat exchange device

Examples

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Embodiment Construction

[0041] Embodiments of the present invention are described in detail below, examples of said embodiments are shown in the accompanying drawings, and the embodiments described below by referring to the accompanying drawings are exemplary, are only used to explain the present invention, and cannot be construed as explanations for the present invention limit. In the description of the present invention, the orientation or positional relationship indicated by the terms "upper", "lower", "front", "rear" etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention. There is no requirement that the invention be constructed and operated in a particular orientation, and thus no limitation should be construed.

[0042] figure 1 is a schematic structural diagram of a heat exchange device according to an embodiment of the present invention. The heat exchange device 100 of the present invention may g...

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Abstract

The invention provides a heat exchange device and a semiconductor refrigerator with the heat exchange device. The heat exchange device comprises a box body and a first refrigerating fluid pipeline; an internal cavity for containing refrigerating fluid is limited by the box body; the first refrigerating fluid pipeline is communicated with the internal cavity of the box body. The heat exchange device further comprises a tee-joint device which is provided with a first end, a second end and a third end; the first end, the second end and the third end are communicated. The first end of the tee-joint device is communicated with the internal cavity of the box body; the second end of the tee-joint device is connected with a first end, forming an opening end, of the first refrigerating fluid pipeline, and the third end of the tee-joint device is a normally-closed end and is configured to be operably opened, so that refrigerating fluid injected from an external refrigerating fluid source can be received. According to the heat exchange device, the tee-joint device is arranged on the refrigerating fluid pipeline; the refrigerating fluid pipeline is used as a refrigerating fluid injection opening of the box body of the heat exchange device, and therefore the number of openings of the box body can be reduced. The possibility of refrigerating fluid outleakage can be reduced.

Description

technical field [0001] The invention relates to refrigeration equipment, in particular to a heat exchange device and a semiconductor refrigerator with the heat exchange device. Background technique [0002] The heat exchange device of the semiconductor refrigerator in the prior art may include a refrigerant tank and a refrigerant pipeline connected thereto, and the refrigerant pipeline is bonded to the hot end of the semiconductor refrigerating sheet through the refrigerant tank. During operation, the refrigerant tank absorbs the heat from the heat source, causing the liquid refrigerant inside to absorb heat and evaporate. Through the refrigerant inlet and outlet connected to the inside of the refrigerant tank through the refrigerant pipeline, heat is transferred along the refrigerant pipeline, and then Convective heat exchange with the surrounding environment, the gaseous refrigerant in the tube is condensed into a liquid state after heat exchange, and returns to the refrig...

Claims

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Application Information

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IPC IPC(8): F25D19/00
CPCF25D19/00
Inventor 张奎李鹏王晶刘昀曦李春阳陶海波
Owner HAIER GRP CORP
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