Error resilient packaged components

An interposer, integrated circuit technology, applied in the field of error recovery packaging components, can solve the problem of unacceptable cost

Active Publication Date: 2015-02-11
ALTERA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the resistance of the device to a sati

Method used

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  • Error resilient packaged components
  • Error resilient packaged components
  • Error resilient packaged components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0101] ADDITIONAL EMBODIMENT 1. A circuit system comprising: an interposer; a first circuit on the interposer characterized by a first reliability metric; and a second circuit on the interposer characterized by a value different from A second reliability measure characterizes the first reliability measure value.

Embodiment approach 2

[0102] Additional embodiment 2. The circuitry of additional embodiment 1, wherein the first reliability measure comprises a fault value over a first time and wherein the second reliability measure comprises a fault value over a second time failure value.

Embodiment approach 3

[0103] Additional embodiment 3. The circuitry of additional embodiment 2, wherein the second temporal fault value of the second circuit is less than the first temporal fault value of the first circuit.

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Abstract

A packaged component may include an interposer and integrated circuit dies mounted on the interposer. At least one of the dies may be a radiation-hardened integrated circuit die, whereas the remaining dies may be non-radiation-hardened dies. If desired, the interposer may be a radiation-hardened interposer whereas the integrated circuit dies may be non-radiation-hardened dies. The radiation-hardened die or the radiation-hardened interposer may include monitor circuitry that is used to test non-radiation-hardened circuitry of the packaged component. Test results may be stored in a database at the monitor circuitry or transmitted to external devices such as a server. The monitor circuitry may be used to reconfigure failed circuitry or may control multiplexing circuitry in the interposer to functionally replace the failed circuitry. If desired, the monitor circuitry may adjust power consumption of non-radiation-hardened circuitry based on the test results.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Patent Application No. 13 / 952,398, filed July 26, 2013, the entire contents of which are hereby incorporated by reference. Background technique [0003] A programmable integrated circuit is a type of integrated circuit that can be configured by the user to implement custom logic functions. Typically, logic designers use computer-aided design (CAD) tools to design custom logic circuits. When the design process is complete, the CAD tool generates configuration data. Configuration data is loaded into the programmable integrated circuit to configure the device to perform the desired logic functions. [0004] Integrated circuits, such as programmable integrated circuits and application specific integrated circuits, are subject to temporary errors, such as errors caused by environmental radiation. For example, charged particles in the environment impinging on circuitry on an integrated...

Claims

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Application Information

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IPC IPC(8): G06F11/26
CPCH03K19/0033
Inventor M·D·赫顿
Owner ALTERA CORP
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