Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Error resilient packaged components

An interposer, integrated circuit technology, applied in the field of error recovery packaging components, can solve the problem of unacceptable cost

Active Publication Date: 2015-02-11
ALTERA CORP
View PDF3 Cites 5 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, increasing the resistance of the device to a satisfactory level would entail an unacceptable amount of cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Error resilient packaged components
  • Error resilient packaged components
  • Error resilient packaged components

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0101] ADDITIONAL EMBODIMENT 1. A circuit system comprising: an interposer; a first circuit on the interposer characterized by a first reliability metric; and a second circuit on the interposer characterized by a value different from A second reliability measure characterizes the first reliability measure value.

Embodiment approach 2

[0102] Additional embodiment 2. The circuitry of additional embodiment 1, wherein the first reliability measure comprises a fault value over a first time and wherein the second reliability measure comprises a fault value over a second time failure value.

Embodiment approach 3

[0103] Additional embodiment 3. The circuitry of additional embodiment 2, wherein the second temporal fault value of the second circuit is less than the first temporal fault value of the first circuit.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A packaged component may include an interposer and integrated circuit dies mounted on the interposer. At least one of the dies may be a radiation-hardened integrated circuit die, whereas the remaining dies may be non-radiation-hardened dies. If desired, the interposer may be a radiation-hardened interposer whereas the integrated circuit dies may be non-radiation-hardened dies. The radiation-hardened die or the radiation-hardened interposer may include monitor circuitry that is used to test non-radiation-hardened circuitry of the packaged component. Test results may be stored in a database at the monitor circuitry or transmitted to external devices such as a server. The monitor circuitry may be used to reconfigure failed circuitry or may control multiplexing circuitry in the interposer to functionally replace the failed circuitry. If desired, the monitor circuitry may adjust power consumption of non-radiation-hardened circuitry based on the test results.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to US Patent Application No. 13 / 952,398, filed July 26, 2013, the entire contents of which are hereby incorporated by reference. Background technique [0003] A programmable integrated circuit is a type of integrated circuit that can be configured by the user to implement custom logic functions. Typically, logic designers use computer-aided design (CAD) tools to design custom logic circuits. When the design process is complete, the CAD tool generates configuration data. Configuration data is loaded into the programmable integrated circuit to configure the device to perform the desired logic functions. [0004] Integrated circuits, such as programmable integrated circuits and application specific integrated circuits, are subject to temporary errors, such as errors caused by environmental radiation. For example, charged particles in the environment impinging on circuitry on an integrated...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F11/26
CPCH03K19/0033
Inventor M·D·赫顿
Owner ALTERA CORP
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com