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Method for improving back-film resin stability

A technology of stability and resin, which is applied in the field of solar back film materials, can solve the problems of polyvinylidene fluoride viscosity drop, high viscosity, poor thermal conductivity of melt, etc., and achieve the effect of improving quality and stability

Inactive Publication Date: 2015-03-04
CHANGZHOU HUITIAN NEW MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The mechanical lightness of PVDF material is large, but its melt thermal conductivity is poor, the viscosity is high, and the viscosity of polyvinylidene fluoride decreases with the increase of shear stress.

Method used

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Examples

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Embodiment Construction

[0011] A method for improving the stability of back film resin, the steps are as follows:

[0012] (1) Preheat the resin to 180~190°C and then transfer it to a metal mold that has been preheated to 165°C, and then heat it to 180~205°C on a hot press until the material is melted and plasticized;

[0013] (2) When the mold temperature rises to 165~175℃, the pressure is started, the pressure is 0.5~3.5MPa, and the pressure needs to be relieved 1~2 times during the hot pressing process;

[0014] (3) When the temperature rises to 180~250℃, the pressure is released, and the mold is moved to the cold press;

[0015] (4) Hold the pressure at 7~35MPa and cool until the mold temperature drops below 50℃ before demoulding;

[0016] (5) The product should be annealed at 130~150℃ for 24h to eliminate internal stress.

[0017] The invention can effectively improve the stability of the back film material and improve the quality in the manufacturing process.

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Abstract

The invention relates to the technical field of solar-energy back-film materials, and especially relates to a method for improving back-film resin stability. The method comprises the following steps: (1) pre-heating resin to 180-190 DEG C, transferring to a metal mold preheated to 165 DEG C, then heating resin to 180-205 DEG C on a hot press until the material is fused and plasticized; (2) when the mold temperature rises to 165-175 DEG C, starting to increase pressure to have a pressure of 0.5-3.5 MPa, and releasing pressure for 1-2 times during the hot press process; (3) when the temperature rises to 180-250 DEG C, starting to release pressure, and transferring the mold to a cold press; (4) keeping pressure when the pressure is 7-35 MPa, cooling, and demolding until the mold temperature drops to 50 DEG C or bellow; and (5) annealing the product under the condition of 130-150 DEG C to eliminate the internal stress. The method is capable of effectively improving the stability of the back-film material and improving the manufacturing technology quality.

Description

technical field [0001] The invention relates to the technical field of solar back film materials, in particular to a method for improving the stability of back film resins. Background technique [0002] The mechanical lightness of PVDF material is large, but its melt thermal conductivity is poor, its viscosity is high, and the viscosity of polyvinylidene fluoride decreases with the increase of shear stress. SUMMARY OF THE INVENTION [0003] In order to overcome the deficiencies of the prior art, the present invention provides a method for improving the stability of the backing film resin. [0004] The technical scheme adopted by the present invention to solve the technical problem is: a method for improving the stability of the back film resin, the steps of which are as follows: [0005] (1) Preheat the resin to 180~190°C and then transfer it to a metal mold that has been preheated to 165°C, and then heat it to 180~205°C on a hot press until the material is melted and pla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/14B29C43/58
CPCB29C43/14B29C43/58B29C2043/5808B29C2043/5816
Inventor 石娜杜震宇
Owner CHANGZHOU HUITIAN NEW MATERIALS