Unlock instant, AI-driven research and patent intelligence for your innovation.

A kind of LED support manufacturing method and application of encapsulation

一种LED支架、LED芯片的技术，应用在半导体器件、电气元件、电路等方向，能够解决变黑、支架端子与塑胶结合气密性不好等问题，达到提高结合性、高可靠性能、提高防潮性能和密性性能的效果

Active Publication Date: 2017-04-12
SUZHOU KINGLIGHT OPTOELECTRONICS CO LTD
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the airtightness of the bracket terminal and the plastic is not good, so the external sulfur and oxygen enter the cup from the bracket pin to react with the silver layer on the surface of the terminal and turn black.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A kind of LED support manufacturing method and application of encapsulation
  • A kind of LED support manufacturing method and application of encapsulation
  • A kind of LED support manufacturing method and application of encapsulation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] The embodiment of the invention discloses a method for manufacturing an LED bracket and the application of packaging, which not only improves the airtightness of the LED structure by increasing the bonding area between the plastic material and the packaging glue, but also uses the plastic material to cover the functional area with the metal pins The gap at the combination improves the moisture-proof performance and reliability of the LED product, and pro...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a method for manufacturing an LED bracket and an application of packaging, comprising: a metal bracket terminal; an LED chip fixed on the metal bracket terminal; bonding for connecting the surface of the metal bracket terminal and the LED chip line; encapsulation glue to protect the LED chip; also includes: plastic material covering the surface of the metal bracket terminal; a plastic reflective cup wrapping the metal bracket terminal; the metal bracket terminal includes Metal pins inside the reflective cup and metal pins arranged outside the plastic material reflective cup, wherein the metal pins are provided with functional areas and non-functional areas. The invention improves the airtightness of the LED structure by increasing the bonding area of ​​the plastic material and the packaging glue; at the same time, the plastic material covers the gap where the metal pin functional area is combined, improving the moisture-proof performance and reliability of the LED product. And prolong the service life.

Description

technical field [0001] The invention relates to the technical field of LED brackets, and more specifically relates to a manufacturing method of LED brackets and an application of encapsulation. Background technique [0002] With the rapid development of indoor and outdoor LED display application technology and lighting technology, surface mount LED devices for display screens are currently used, but their performance, especially in terms of reliability, cannot meet the requirements of the market. [0003] Surface-mounted LED devices for display screens and lighting, especially outdoor LED devices, have high requirements for environmental adaptability, and need to have excellent moisture-proof performance and high and low temperature resistance. However, at present, the LED display still maintains a high failure rate, and one of the reasons is that the encapsulation colloid and the material in the reflective cup are peeled off. And lighting products also have vulcanization a...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/48H01L33/54H01L33/62
CPCH01L33/48H01L33/52H01L33/60H01L33/62H01L2933/005H01L2224/48247H01L2224/48091H01L24/45H01L2224/45139H01L2224/45144H01L2224/45147H01L2224/45565H01L2224/45644H01L24/48H01L25/0753H01L33/486H01L2924/00014H01L33/501H01L33/56H01L2933/0058
Inventor 龚文邵鹏睿周姣敏
Owner SUZHOU KINGLIGHT OPTOELECTRONICS CO LTD