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Processing apparatus

A technology for processing devices and processed objects, which is applied in the direction of fine working devices, measuring devices, grinding devices, etc., can solve the problem of inability to detect the depth and cross-sectional shape of cutting grooves, the state of cutting groove depths, cross-sectional shapes and debris, Unable to adjust processing conditions in three-dimensional processing, unable to verify the concave and convex state of grinding marks, etc.

Active Publication Date: 2015-03-18
DISCO CORP
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Problems solved by technology

[0011] However, the image captured by the imaging unit is a two-dimensional image, and there is a problem that the depth and cross-sectional shape of the cutting groove, the depth, cross-sectional shape, and chip state of the laser-processed groove cannot be detected, and the adjustment cannot be made according to the three-dimensional processing. Processing conditions
[0012] Also, since the image captured by the imaging unit is a two-dimensional image, there is a problem that the unevenness of the grinding marks cannot be verified in the grinding device.

Method used

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Embodiment Construction

[0032] Hereinafter, preferred embodiments of the processing apparatus according to the present invention will be described in more detail with reference to the drawings.

[0033] figure 1 A perspective view of a laser processing device as a processing device according to the present invention is shown. figure 1 The laser processing apparatus 1 shown has: a stationary base 2; a chuck table mechanism 3 arranged on the stationary base so as to be movable in a machining feed direction (X-axis direction) indicated by an arrow X 2 and hold the workpiece;

[0034] The above-mentioned chuck table mechanism 3 has: a pair of guide rails 31, 31 arranged in parallel on the stationary base 2 along the processing feed direction, that is, the X-axis direction shown by the arrow X; It is disposed on the guide rails 31 and 31 so as to be movable in the X-axis direction; the second sliding block 33 is disposed on the first sliding block so as to be movable in the Y-axis direction perpendicula...

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Abstract

A processing apparatus including a chuck table for holding a workpiece, a processing unit for processing the workpiece held on the chuck table, and a feeding mechanism for relatively moving the chuck table and the processing unit in an X direction as a feeding direction. The processing apparatus further includes a three-dimensional imaging mechanism for imaging the workpiece held on the chuck table in three dimensions composed of the X direction, a Y direction perpendicular to the X direction, and a Z direction perpendicular to both the X direction and the Y direction and then outputting an image signal obtained above, a control unit for generating a three-dimensional image according to the image signal output from the three-dimensional imaging mechanism, and an output unit for outputting the three-dimensional image generated by the control unit.

Description

technical field [0001] The present invention relates to processing devices such as a laser processing device, a cutting device, and a grinding device for performing predetermined processing on a workpiece such as a wafer. Background technique [0002] In the semiconductor device manufacturing process, a plurality of regions are divided by dividing lines arranged in a grid pattern on the front surface of a substantially disk-shaped wafer, and devices such as ICs and LSIs are formed in the divided regions. Then, after the back surface of the wafer is ground to a predetermined thickness, the wafer is cut along planned dividing lines to separate regions in which devices are formed to manufacture individual devices. [0003] A grinding apparatus for grinding the back surface of a wafer has the following parts: a chuck table holding the wafer; a grinding unit having a grinding wheel for grinding the wafer held by the chuck table; and A thickness measuring unit measures the thickn...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B37/00B28D5/00B23K26/38B23K26/70
CPCG01N27/82H04N13/0203B23K26/38B24B7/228B24B47/20B24B49/12B28D5/0005B28D7/00G01B11/0608H01L21/67092H01L21/681H01L21/30H01L21/304H01L21/677H01L22/00H04N13/204
Inventor 伊藤优作
Owner DISCO CORP