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Image acquisition module

An image acquisition and image sensing technology, which is applied in the directions of image communication, TV, and color TV parts, etc., can solve the problems of large assembly angle of sensor bracket, image sensor, and the inability to effectively improve image quality, etc., so as to reduce the assembly angle , to ensure the effect of flatness

Inactive Publication Date: 2015-03-18
LITE ON TECH CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention is to provide an image acquisition module for reducing the assembly inclination angle, which can effectively solve the problem of "since the image sensors and sensor brackets in the known image acquisition module are all stacked sequentially with the circuit board as the stacking reference plane." On top of that, the assembly inclination angle of the sensor bracket relative to the image sensor is too large, resulting in the defect that the image quality obtained by the known imaging module cannot be effectively improved”

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Examples

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no. 1 example 〕

[0036] see Figure 1 to Figure 3 As shown, the first embodiment of the present invention provides an image acquisition module M for reducing the assembly inclination angle, which includes: an image sensing unit 1 , an optical auxiliary unit 2 and a leveling auxiliary unit 3 .

[0037] First, cooperate figure 1 and figure 2 As shown, the image sensing unit 1 includes a carrier substrate 10 and an image sensing chip 11 disposed on the carrier substrate 10 and electrically connected to the carrier substrate 10 . For example, the image sensing chip 11 can be disposed on the carrier substrate 10 by adhesive (not numbered, such as UV adhesive, thermosetting adhesive, or oven curing adhesive, etc.). In addition, the carrier substrate 10 can be a circuit substrate with a plurality of conductive pads (not labeled) on the upper surface, the upper surface of the image sensing chip 11 has a plurality of conductive pads 111, and each conductive pad 111 of the image sensing chip 11 The ...

no. 2 example

[0042] see Figure 4 As shown, the second embodiment of the present invention provides an image acquisition module M for reducing the assembly inclination angle, which includes: an image sensing unit 1 , an optical auxiliary unit 2 and a leveling auxiliary unit 3 . Depend on Figure 4 and figure 1 It can be seen from the comparison that the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the leveling auxiliary unit 3 includes a transparent lens arranged between the image sensing chip 11 and the frame case 20 The light-leveling substrate 31 and a micro-spacer 32 extending downward from the bottom surface of the light-transmitting leveling substrate 31 to directly contact the image sensing chip 11, wherein the light-transmitting leveling substrate 31 can pass through a plurality of micro-spacers 32 to be It is supported above the image sensing chip 11 , and the frame housing 20 can directly c...

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Abstract

Provided is an image acquisition module which comprises an image sensing unit, an optical auxiliary unit and a leveling auxiliary unit. The image sensing unit comprises a bearing substrate and an image sensing chip which is arranged on the bearing substrate. The optical auxiliary unit comprises a framework shell which is arranged on the bearing substrate to cover the image sensing chip and a lens assembly which is arranged in the framework shell. The leveling auxiliary unit comprises multiple adhesion objects which are arranged on the image sensing chip and a light-transmitting leveling substrate which is supported on the image sensing chip via the multiple adhesion objects. The framework shell directly contacts and downwardly abuts against the light-transmitting leveling substrate, and each adhesion object comprises adhesion glue and multiple micro support bodies which are mixed into adhesion glue. Therefore, an assembling inclination angle of the framework shell relative to the image sensing chip can be effectively reduced so that smoothness of the framework shell relative to the image sensing chip is ensured.

Description

technical field [0001] The invention relates to an image acquisition module, in particular to an image acquisition module for reducing assembly inclination. Background technique [0002] In recent years, it has become increasingly common for handheld devices such as mobile phones and PDAs to be equipped with imaging modules. With the market demand for better functions and smaller volumes of handheld devices in the product market, imaging modules have become Faced with the dual requirements of higher image quality and miniaturization. For the improvement of the picture quality of the imaging module, on the one hand, it is to increase the pixels. The market trend has been improved from the original VGA level of 30 pixels to the current common 2 million pixels and 3 million pixels in the market, and even more has been launched A higher level of eight megapixels or more. In addition to the improvement of pixels, another aspect is about the clarity of imaging. Therefore, the im...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04N5/225
Inventor 詹欣达
Owner LITE ON TECH CORP