Circuit board and its manufacturing method
A manufacturing method and circuit board technology, which is applied in multilayer circuit manufacturing, printed circuit manufacturing, circuit board tool positioning, etc., can solve problems such as difficult application, and achieve the effect of improving alignment accuracy and good alignment accuracy
Active Publication Date: 2018-07-13
UNIMICRON TECH CORP
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- Description
- Claims
- Application Information
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Problems solved by technology
In addition to the above-mentioned alignment method, in the general integrated circuit substrate (integrated circuit substrate, IC substrate) manufacturing process, it uses a laser beam (laser beam) to cut off the two surfaces of the substrate to form an alignment. through holes, but the above approach is not easy to apply to multilayer printed circuit boards
Method used
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Embodiment Construction
[0043] Figure 1A to Figure 1D It is a schematic cross-sectional flow chart of a manufacturing method of a circuit board according to an embodiment of the present invention. In this embodiment, the circuit board 100 (shown in Figure 1D ) The production method includes the following steps. The following will be passed in order Figure 1A to Figure 1D The method of manufacturing the circuit board 100 is explained with text.
[0044] First, please refer to Figure 1A In this embodiment, a core layer 110 is provided, wherein a first core circuit 120 and at least one first positioning ring 130 are formed on the first surface S1 of the core layer 110. The core layer 110 is, for example, a substrate or a core dielectric layer. The core layer 110 may be pre-processed through machining processes such as drilling or laser. A conductive layer not shown is formed on the first surface S1 of the core layer 110 by a plating process, and is patterned by a photolithography process to form the fi...
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The invention discloses a circuit board and a manufacturing method of the circuit board. The method comprises the following steps that a core layer is provided, wherein a first core circuit and at least one first positioning ring are formed on the first surface of the core layer; a first layer adding circuit structure is pressed on the first surface, and covers the first core circuit and the first positioning ring, wherein the first layer adding circuit structure comprises a first conducting layer and a first dielectric layer, and the first dielectric layer is positioned between the first conducting layer and the first core circuit; the first layer adding circuit structure corresponding to the partial first layer adding circuit structure of the first positioning ring is removed for exposing the first positioning ring; a first conducting hole is formed in the first layer adding circuit structure by using the first positioning ring as a positioning point, wherein the first conducing hole corresponds to a first connecting pad of the first core circuit.
Description
Technical field [0001] The invention relates to a circuit board and a manufacturing method thereof, and in particular to a multilayer circuit board and a manufacturing method thereof. Background technique [0002] In recent years, in order to increase the application of printed circuit boards (printed circuit boards, PCBs), there are already many technologies towards making printed circuit boards into multilayer board structures, such as the EveryLayer Interconnection Board (EveryLayer Interconnection Board). , ELIC). The multilayer board structure is made by repeatedly stacking and pressing a build-up structure composed of copper foil and prepreg (pp) on the core layer to increase the inside of the printed circuit board In the wiring space, the electroplating process is used to fill the conductive hole with conductive material to conduct each layer. Since the purpose of the multilayer board structure is to increase the wiring space by pressing the multilayer board, the connect...
Claims
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IPC IPC(8): H05K3/46H05K1/02
CPCH05K3/0008H05K3/4644H05K2203/1509
Inventor 林爱华余丞博黄培彰黄瀚霈
Owner UNIMICRON TECH CORP