Mounting device for mounting the sensor
A technology for installing devices and sensors, which is applied in metal processing, metal processing equipment, hand-held tools, etc., can solve the problems of sensor overpressure, sensor internal structure damage, insufficient, etc., and achieve the effect of reducing accuracy requirements
Inactive Publication Date: 2018-02-16
TYCO ELECTRONICS (SHANGHAI) CO LTD
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Problems solved by technology
However, for some sensitive sensors, such as micro-electromechanical system (MEMS) sensors, optical fiber sensors, etc., a large external force can easily cause damage to the internal structure of the sensor and cause it to fail.
Or due to the deviation of the accuracy of the installation position, the sensor is over-pressured or the pressure is not enough, resulting in the sensor not working properly
Method used
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[0025] Embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements. The embodiments described below with reference to the figures are exemplary and are intended to explain the present invention, and should not be construed as limiting the present invention.
[0026] figure 1 A schematic perspective view showing an installation device for installing the sensor 30 according to an exemplary embodiment of the present invention; figure 2 show figure 1 The three-dimensional schematic diagram of the installation bracket 10 of the installation device for installing the sensor 30; image 3 show figure 1 A three-dimensional schematic diagram of the support rod 20 of the installation device for installing the sensor 30 in FIG.
[0027] exist Figure 1 to Figure 3 In the exemplary embodiment shown, a mounting arrangement for mounting t...
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The invention discloses an installation device for installing a sensor. The installation device for installing the sensor comprises an installation support, supporting rods and elastic elements. Guide holes are formed in the installation support. The supporting rods penetrate through installation holes in a shell of the sensor and the guide holes in the installation support and are fixed to the shell of the sensor and the installation support. The elastic elements are installed between the supporting rods and the installation support so that the sensor can overcome the deformation force of the elastic elements to move along the supporting rods relative to the installation support. Thus, when outside trigger action force or trigger displacement is too large, the sensor can overcome the initial deformation force of the elastic elements to move relative to the installation support, so that a certain elastic release space is reserved for the trigger action of the sensor through elastic buffering, the requirement for the precision of an installation position can be effectively lowered, the sensor can also be effectively protected when overlarge action force or overlarge trigger displacement occurs, and thus the sensor can still work normally under the condition of overlarge action force or overlarge trigger displacement.
Description
technical field [0001] The invention relates to a mounting device for mounting a sensor. Background technique [0002] Existing contact sensors generally adopt a non-flexible fixed installation method, which requires high installation and positioning accuracy, and the sensor itself also needs to have high mechanical strength to resist triggering the sensor action (contact or closing action). ) greater force. However, for some sensitive sensors, such as micro-electromechanical system (MEMS) sensors, optical fiber sensors, etc., a large external force can easily cause damage to the internal structure of the sensor and cause it to fail. Or due to the deviation of the accuracy of the installation position, the sensor is over-pressurized or the pressure is not enough, resulting in the sensor not working properly. Contents of the invention [0003] The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and deficiencies in the prior...
Claims
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IPC IPC(8): B23P19/04
CPCB25B27/00
Inventor 林麟童朝阳
Owner TYCO ELECTRONICS (SHANGHAI) CO LTD