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A grinding disc device

A technology of grinding disc and grinding process, applied in the direction of grinding tools, etc., can solve the problems of small contact area between grinding crystal and grinding pad, unsatisfactory grinding effect, etc., and achieve the effect of reducing scratches

Active Publication Date: 2017-03-15
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The above-mentioned patent reduces the shedding degree of the crystal by setting the grinding crystal, thereby reducing the chance of the wafer being scratched, but the contact area between the grinding crystal and the polishing pad is small, so the grinding effect is not ideal

Method used

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  • A grinding disc device
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Embodiment Construction

[0028] The invention provides a grinding disc device, which can be applied to processes with technology nodes of 90nm, 65 / 55nm, 45 / 40nm, 32 / 28nm, greater than or equal to 130nm and less than or equal to 22nm; it can be applied to the following technical platforms: Logic, Memory, RF, HV, Analog / Power, MEMS, CIS, Flash, eFlash.

[0029] A kind of grinding disc device, is applied in the chemical mechanical grinding process, is characterized in that, described device comprises:

[0030] A grinding disc main body, the surface of which is provided with a plurality of protruding diamonds whose tops are located at the same height, and the diamonds are partially embedded in the surface of the grinding disc main body;

[0031] A fixed ring is arranged around the edge of the main body of the grinding disc, and the top of the fixed ring is at the same height as the tops of the plurality of diamonds;

[0032] A vacuum conduit, the nozzle of the vacuum conduit is arranged on the surface of...

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Abstract

The invention provides a grinding disk device applied in a chemical and mechanical grinding technology. The device comprises a grinding disk body, a fixing ring and a vacuum guide pipe, wherein a plurality of pieces of convex diamond with the tops at the same height are arranged on the surface of the grinding disk body, and the diamond part is embedded in the surface of the grinding disk body; the fixing ring is arranged around the edge of the grinding disk body in a surrounding mode, and the top of the fixing ring and the tops of the multiple pieces of diamond are at the same height; the pipe opening of the vacuum guide pipe is formed in the surface of the grinding disk body. In the wafer grinding process, the falling diamond is fixed in the fixing ring by the fixing ring, diamond particles are discharged into a water draining opening of a grinding machine table through the vacuum guide pipe, the water draining opening is connected with a sucker, and it is prevented that because the diamond particles falling from the grinding disk make contact with the surface of a wafer, the wafer is scratched.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit manufacturing, in particular to a grinding disc device. Background technique [0002] In the field of large-scale integrated circuit manufacturing, the chemical mechanical polishing process is a complicated process. It contacts the surface of the wafer with the polishing surface of the polishing pad, and then makes the original unevenness through the friction between the surface of the wafer and the polishing pad. The surface of the wafer becomes flat, and the function of the grinding disc is to keep the grinding pad rough during the grinding process, so as to keep the grinding rate stable. The grinding discs currently used in the industry (such as Figures 1A-1B ) is prepared by adhering fine diamond particles on the stainless steel plate. There is a risk of falling during the contact grinding process with the polishing pad. The diamond particles falling on the polishing p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/11
CPCB24B37/11
Inventor 赵正元李虎张守龙
Owner SHANGHAI HUALI MICROELECTRONICS CORP