Analysis methods of physical characteristics of semiconductor devices

Abstract

The invention discloses a method for analyzing physical characteristics of a semiconductor device. The method comprises the following steps: performing external physical characteristic analysis on a semiconductor device sample; performing X-ray nondestructive structure analysis; performing acoustic scanning microscope nondestructive material analysis; performing external physical characteristic solvent test; and performing internal process characteristic analysis. According to the method for analyzing the physical characteristics of the semiconductor device provided by the invention, counterfeited and renovated low-quality devices are removed by using clear and precise test methods and judgment basis.

Description

technical field [0001] The invention relates to the technical field of detection and analysis of semiconductor devices, in particular to a method for analyzing physical properties of semiconductor devices. Background technique [0002] At present, the semiconductor component market is flooded with a large number of inferior components, mainly including low-manufacturing process devices and counterfeit refurbished devices. Among them, counterfeit integrated circuits have poor quality consistency of internal processes (package process, bonding process, chip manufacturing process, etc.) and cannot meet the needs of integrated circuit systems. Once the assembly is completed and put into use, it is prone to failure and seriously affects the integrated circuit system. reliability, even causing heavy losses. For refurbished integrated circuits, problems such as product aging, product refurbishment damage, etc., have huge reliability hidden dangers. Once assembled and used, the rel...

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Problems solved by technology

Among them, counterfeit integrated circuits have poor quality consistency in their internal processes (packaging process, bonding process, chip manufacturing process, etc.), which cannot meet the needs of integrated circuit systems. Once assembled and put into use, they are prone to failures and seriously affect integrated circuit systems. reliability, and even cause major losses

For refurbished integrated circuits, there are huge hidden dangers in reliability, such as product aging and product refurbishment damage. Once assembled and used, it will seriously affect the reliability, operation stability and service life of the integrated circuit system.

[0003] Once these inferior semiconductor devices flow into the manufacturing process, they will directly affect the production cycle, product quality, product safety and service life of the product, and threaten the life and property safety of users and others.

[0004] At this stage, there are no relevant inspection and testing standards in China to eliminate counterfeit and refurbished inferior devices

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