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Package structure and optical module

A packaging structure and optical module technology, which is applied in the field of optical modules, can solve the problems of small thermal conductivity and affect the heat dissipation effect, and achieve the effect of ensuring stable operation, large heat dissipation area, and good heat dissipation capacity

Active Publication Date: 2018-05-04
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The further defects brought about by this are: 1) The tolerance capability of the current process requires that the via hole design needs to ensure that the welding ring is at least 3-4mil on one side of the drilling hole, and the minimum drilling hole is 0.15mm, that is, the effective heat dissipation cross-sectional area and the occupied PCB The area ratio is less than 1 / 4; 2) Copper paste is used for copper filling, and copper paste contains a certain proportion of adhesive, and its thermal conductivity is smaller than that of pure copper, so it will affect the heat dissipation effect

Method used

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  • Package structure and optical module
  • Package structure and optical module
  • Package structure and optical module

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Experimental program
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Embodiment 1

[0053] ginseng image 3 with Figure 4 The cross-section of the cooling hole 12 in the thickness direction of the printed circuit board 11 is T-shaped. The cooling block 13 includes a first cooling block 131 and a second cooling block 132 connected to each other. The cross-sectional area of ​​the first cooling block 131 is smaller than that of the second cooling block. The cross-sectional area of ​​the block 132 is matched to be installed in the T-shaped cooling hole 12 . The "cross-sectional area" mentioned here refers to the area of ​​the figure obtained by intersecting the plane parallel to the printed circuit board 11 and the heat dissipation block 13; The heat dissipation block 132" may comprise that the first heat dissipation block 131 and the second heat dissipation block 132 are manufactured and connected separately or the first heat dissipation block 131 and the second heat dissipation block 132 are integrally manufactured.

[0054] On the basis of this embodiment, ...

Embodiment 2

[0056] ginseng Figure 5 to Figure 7 The cross-section of the heat dissipation hole 12a in the thickness direction of the printed circuit board 11a is trapezoidal. Correspondingly, the cross-sectional area of ​​the heat dissipation block 13a gradually increases in the direction extending from the first surface 111a of the printed circuit board 11a to the second surface 112a.

[0057] continue to participate Figure 1 to Figure 4 , in this embodiment, the opening 121 of the heat dissipation via 12 on the first surface 111 is adapted to the power device 15, that is, the power device 15 can pass through the opening 121 of the heat dissipation via 12 on the first surface 111 and the heat dissipation block 13 fully Thermal contact to ensure high efficiency of heat conduction. The heat dissipation block 13 is fixed to the inner wall of the heat dissipation hole 12 by filling glue (not shown in the figure). The heat dissipation block 13 , the first heat dissipation layer 141 , and ...

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Abstract

The present application discloses a packaging structure and an optical module. The packaging structure includes: a printed circuit board having a first surface and a second surface opposite to each other; a cooling hole penetrating through the first surface and the second surface of the printed circuit board; The heat dissipation block fixed in the heat dissipation hole; the power device arranged on the first surface of the printed circuit board, and the power device is thermally connected with the heat dissipation block. In the technical solution of the present application, since the heat dissipation block is fixedly arranged in the heat dissipation hole, the heat dissipation block can be prepared in advance according to the shape of the heat dissipation hole, and there is no need to add adhesives and other materials with low thermal conductivity during the preparation of the heat dissipation block. At the same time, since there is no need to consider the problem of fixing the copper paste and the heat dissipation hole, the heat dissipation hole can be opened larger, which ensures better heat dissipation capacity of the package structure and stable operation of the device.

Description

technical field [0001] The invention belongs to the technical field of manufacturing optical communication components, and in particular relates to a packaging structure and an optical module using the packaging structure. Background technique [0002] With the rapid development of 4G communication and the increasing demand for cloud computing, the market demand for high-speed optical modules is increasing day by day. Taking the 100G optical module as an example, its power consumption has greatly increased compared with the 40G optical module, but if it is necessary to use the same package size as the 40G optical module, the heat generated per unit area will also increase accordingly. In such a case, if a good heat dissipation effect cannot be guaranteed, the performance of the temperature-sensitive electro-optic / photoelectric conversion circuit in the optical module will be reduced or even fail. [0003] In the traditional 40G optical module packaging method, COB (chip on ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/31H01L23/367
CPCH05K1/0204H05K1/0209H05K2201/10416
Inventor 方习贵王克武郭金明周新军王祥忠
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD