Check patentability & draft patents in minutes with Patsnap Eureka AI!

Transfer device and substrate treatment apparatus

A transfer printing and substrate technology, applied in printing devices, lighting devices, rotary printing machines, etc., can solve problems such as pattern residue

Active Publication Date: 2015-04-08
NIKON CORP
View PDF12 Cites 12 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, in the transfer method, when the pattern layer is transferred to the substrate, part of the pattern may remain on the transfer plate.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Transfer device and substrate treatment apparatus
  • Transfer device and substrate treatment apparatus
  • Transfer device and substrate treatment apparatus

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0034] The first embodiment according to the present invention will be described.

[0035] figure 1 It is a perspective view showing the structure of the transfer device 100 of this embodiment.

[0036] Such as figure 1 As shown, the transfer device 100 uses a porous sheet Ts as a transfer plate that is flexible and formed in an endless belt shape from a porous material, and transfers the pattern formed on the outer peripheral surface Ta of the porous sheet Ts. A device for transferring a layer onto a film-like substrate P as a transfer object. The transfer apparatus 100 has a sheet holding portion (plate holding portion) 10 holding the porous sheet Ts, a substrate holding portion (object holding portion) 20 holding the substrate P, and an inner peripheral surface Tb of the porous sheet Ts. A gas supply unit (fluid supply unit) 30 that supplies gas to the side of the outer peripheral surface Ta. In addition, as the substrate P, resin films such as PET (polyethylene terepht...

no. 2 approach

[0083] A second embodiment of the present invention will be described.

[0084] Figure 9 The overall structure of the equipment manufacturing system (substrate processing apparatus) 1 to which the transfer apparatus 100 of the above-mentioned first embodiment is applied is shown.

[0085] Such as Figure 9 As shown, the manufacturing line of this embodiment is provided with: a pre-processing device U1 for performing predetermined pre-processing (surface modification, etc.) on the elongated substrate P wound on the supply roll FR1; a transfer device U2 , which performs pattern transfer on the pre-processed substrate P; and a post-processing device U3, which performs subsequent processing on the pattern-transferred substrate P.

[0086] The transfer device U2 employs the transfer device 100 of the first embodiment described above. In addition to the sheet holding unit 10, the substrate holding unit 20, and the gas supply unit 30 described in the above-mentioned first embodim...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A transfer device is provided with: a plate holding part for holding a transfer plate having a porous plate formed from a porous material with a predetermined thickness and a transfer pattern layer formed on one surface side of the porous plate; an object holding part for holding an object to which the pattern layer of the transfer plate can be transferred in close contact with or in proximity to one surface of the transfer plate; and a fluid supply part for supplying a fluid with a predetermined pressure from the other surface side to the one surface side of the porous plate.

Description

technical field [0001] The present invention relates to a transfer device and a substrate processing device. [0002] this application claims priority based on Japanese Patent Application No. 2012-173983 for which it applied on August 6, 2012, and uses the content here. Background technique [0003] As a display element constituting a display device such as a display device, for example, a liquid crystal display element, an organic electroluminescence (organic EL) element, an electrophoretic element used in electronic paper, and the like are known. As one of methods for producing the above-mentioned element, for example, a method called a roll-to-roll method (hereinafter simply referred to as “roll method”) is known (for example, refer to Patent Document 1). [0004] The roller method is to send out a sheet-shaped substrate wound on the roller on the substrate supply side, and convey the substrate while winding the sent substrate with the roller on the substrate recovery si...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B41F17/10B41F17/14B41M1/26H01L51/50H05B33/10H10K99/00
CPCH01L51/56H01L27/3244B41F17/14H01L51/0013B41F17/10H01L51/0005H10K59/12H10K71/18H10K71/135
Inventor 铃木智也
Owner NIKON CORP
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com