A method of manufacturing a circuit board with stepped grooves

Abstract

The invention discloses a manufacturing method of a circuit board with a step groove. The manufacturing method includes the following steps that: an isolation cage is manufactured, and the isolation cage is pasted at a step groove position of the surface of an inner-layer board; an outer-layer board is fittingly pressed on the inner-layer board, and a through hole is formed at a step groove position of the outer-layer board in advance, and after being fittingly pressed, the isolation cage can be located in the through hole; and the isolation cage is taken out from the through hole, so that a step groove can be formed. According to the technical scheme of the invention, the isolation cage is adopted to directly from the step groove without a deep milling control step required, and therefore, techniques are simple; and gaskets are not adopted, and therefore, problems of being difficult to remove the gaskets and gasket residuals can be solved, and the problem of high possibility of delamination caused by the gaskets can be also solved.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for manufacturing a circuit board with stepped grooves. Background technique [0002] Due to requirements such as installing electronic components on the circuit board, it is usually necessary to make stepped grooves on the circuit board. At present, the commonly used methods for making step grooves on circuit boards include: firstly press the inner layer where the bottom surface of the step groove is located, manually cover the position where the step groove needs to be processed on the inner layer surface, and paste on the gasket. Tape; then carry out the outer layer lamination, after the lamination, use controlled depth milling to open the groove, expose the gasket and tape above the step groove and remove them by hand, thus forming the step groove. [0003] However, the above-mentioned step groove manufacturing method has the following problems: it needs cont...

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Problems solved by technology

[0003] However, the above-mentioned step groove manufacturing method has the following problems: it needs controlled depth milling and slotting, and the process is complicated; there will be glue flow above the gasket covered at the step groove position, which makes it difficult to remove the gasket; there will be some residues on the gasket itself At the bottom of the step groove, it is difficult to remove cleanly; the high position of the gasket and tape during the pressing process will cause its periphery to delaminate easily

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