Wafer cooling tray

A tray and wafer technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of reduced work efficiency, poor cooling effect, inconvenience in picking and placing wafers, etc., to improve cooling efficiency, facilitate transportation, clamping Easy to put and take effect

Inactive Publication Date: 2015-04-29
WUXI KENUODA ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of processing silicon wafers, wafer trays are needed to carry and cool the processed wafers. However, the wafer boxes currently used are inconvenient to take and place wafers, and the cooling effect is poor, which hinders the handling and management of wafers during the production process. It cannot be continuously used in wafer production and cleaning operations, which reduces work efficiency

Method used

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  • Wafer cooling tray
  • Wafer cooling tray

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] see figure 1 and figure 2 , the embodiment of the present invention includes:

[0018] A wafer cooling tray, comprising a tray body 1 and a plurality of wafer cooling stages 2 arranged on the tray body, the wafer cooling stages 2 are protrudingly arranged on the tray body 1, and the wafer cooling stages 2 are composed of three Arc-shaped pieces 3 are spliced ​​together in a ring. The wafer cooling table 2 is an inverted circular frustum. The bottom of the arc-shaped pieces 3 is fixed on the tray body 1. The...

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Abstract

The invention discloses a wafer cooling tray which comprises a tray main body and a plurality of wafer cooling tables arranged on the tray main body, wherein the wafer cooling tables are arranged on the tray main body in a projecting way; each wafer cooling table is formed by annularly splicing three arc-shaped sheets and is an inverted circular truncated cone body; the bottoms of the arc-shaped sheets are fixed on the tray main body, gaps are formed among the arc-shaped sheets, and breathable holes are formed in the outer side surfaces of the arc-shaped sheets. By the mode, the wafer cooling tray can cool and carry the wafer, is convenient for transportation, is convenient to clamp, place and take and greatly improves the cooling efficiency.

Description

technical field [0001] The invention relates to the field of wafer processing, in particular to a wafer cooling tray. Background technique [0002] With the development of electronic technology, silicon wafers are widely used. The silicon wafers used in the production of silicon semiconductor integrated circuits need to be refined from silicon dioxide ore in an electric arc furnace, chlorinated with hydrochloric acid, and distilled to produce high-purity polysilicon. . [0003] In the process of processing silicon wafers, wafer trays are needed to carry and cool the processed wafers. However, the wafer boxes currently used are inconvenient to take and place wafers, and the cooling effect is poor, which hinders the handling and management of wafers during the production process. It cannot be continuously used in wafer production and cleaning operations, which reduces work efficiency. Contents of the invention [0004] The main technical problem to be solved by the present...

Claims

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Application Information

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IPC IPC(8): H01L21/673
CPCH01L21/67333
Inventor 黄根友
Owner WUXI KENUODA ELECTRONICS
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