Cleaning-free solid-state scaling powder for aluminum low-temperature soldering and preparing method

A no-cleaning and soldering technology, applied in welding equipment, welding media, manufacturing tools, etc., can solve the problems of poor electrochemical corrosion resistance of low-temperature active solder joints, fast tinning speed, low moisture absorption, etc. Achieve the effect of improving the reliability of solder joints, promoting spreading, and increasing the life of solder joints

Active Publication Date: 2015-05-13
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0015] The present invention aims to overcome technical defects such as insufficient low-temperature activity of existing aluminum soldering agents, corrosive residues after welding, and poor electrochemical corrosion resistance of solder joints, and provides a no-cleaning solid-state soldering agent for aluminum low-temperature soldering. Flux and its prepara

Method used

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  • Cleaning-free solid-state scaling powder for aluminum low-temperature soldering and preparing method
  • Cleaning-free solid-state scaling powder for aluminum low-temperature soldering and preparing method
  • Cleaning-free solid-state scaling powder for aluminum low-temperature soldering and preparing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0048] A no-clean solid flux used for aluminum low-temperature soldering, the raw material formula components are as follows:

[0049]

[0050] Preparation method: prepare triethylenetetramine, diethanolamine and alcohol as an organic amine alcohol solution with a weight ratio of 1:2, and prepare an acid alcohol solution with a weight ratio of fluoroboric acid, stearic acid and alcohol with a weight ratio of 1:3. Titrate the organic amine alcohol solution with an acid alcohol solution in the kettle to pH = 7 and let it stand for 24 hours; put the organic amine hydrochloride alcohol solution in a polytetrafluoroethylene evaporating dish, heat it to 135±5°C and continue at 90r / min Stir at a high speed until the alcohol and water are removed, and cool to obtain a solid mixture of triethylenetetraamine fluoroborate and diethanolamine stearate; take the above-mentioned mass fraction of organic amino acid salt in a reaction kettle and heat it to 110±5°C , add zinc oxide to the li...

Embodiment 2

[0052] A no-clean solid flux used for aluminum low-temperature soldering, the raw material formula components are as follows:

[0053]

[0054] Preparation method: prepare hydroxyethylethylenediamine, triethanolamine and alcohol as an organic amine alcohol solution with a weight ratio of 1:3, and prepare an acid alcohol solution with a weight ratio of fluoroboric acid, hydrofluoric acid and alcohol with a weight ratio of 1:5, Titrate the organic amine alcohol solution with acid alcohol solution to pH = 7 in the reaction kettle and let it stand for 48 hours; put the organic amine hydrochloride alcohol solution in a polytetrafluoroethylene evaporating dish, heat it to 135±5°C and continuously heat it for 60r Stir at a speed of 1 / min until the alcohol and water are removed, and cool to obtain a solid mixture of hydroxyethylethylenediamine fluoroborate and triethanolamine hydrofluoride; take the above-mentioned mass fraction of organic amino acid salt in a reaction kettle, and h...

Embodiment 3

[0056] A no-clean solid flux used for aluminum low-temperature soldering, the raw material formula components are as follows:

[0057]

[0058] Preparation method: hydroxydiethylethylenediamine, ethylenediamine and alcohol are prepared into an organic amine alcohol solution with a weight ratio of 1:1, and adipic acid, fluoroboric acid and alcohol are prepared into an acid alcohol solution with a weight ratio of 1:4 , Titrate the organic amine alcohol solution with an acid alcohol solution in the reaction kettle to pH = 7 and then place it for 24 hours; place the organic amine hydrochloride alcohol solution in a polytetrafluoroethylene evaporating dish, heat it to 135±5°C and continuously Stir at a speed of 80r / min until the alcohol and water are removed, and cool to obtain a solid mixture of hydroxydiethylethylenediamine adipate and ethylenediamine fluoroborate; take the above mass fraction of organic amino acid salt in the reaction kettle , heated to 110±5°C, adding zinc o...

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Abstract

The invention discloses cleaning-free solid-state scaling powder for aluminum low-temperature soldering and a preparing method. According to the weight percentage, the cleaning-free solid-state scaling powder comprises raw materials of 6.5%-18% of metal film-forming agents, 5%-18% of organic carriers, 0.1%-1.8% of corrosion inhibition agents and the allowance of film removing active agents. The film removing active agents are composite salt of organic amine and acid. The cleaning-free solid-state scaling powder is suitable for lead-free solder wires with solid-state scaling powder contained in a core, and the powder can be used for automatic welding, manual soldering iron welding or flame spraying welding. The core-contained solder wires prepared with the scaling powder have the advantages that tinning speed is high, splashing is low, irritating smoke is avoided, post-welding residues do not have corrosiveness, a welding point has great electrochemical corrosion resistance, a contact service time is long, the wires are suitable for assembling welding of an aluminum coated layer circuit board and an aluminum soldering pin electronic element and brazing of an aluminum electric cable wire, an aluminum radiator and aluminum heat exchanging equipment.

Description

technical field [0001] The present invention relates to a flux for aluminum and aluminum alloy soldering, in particular to a post-welding no-cleaning low-corrosion solid flux for low-temperature soldering of aluminum and aluminum alloys and a preparation method thereof. It can be used as a flux for the inner core of a variety of lead-free solder wires, and as a soldering material for aluminum heat exchangers in the fields of electronics, electrical appliances, and energy and chemical industries. Background technique [0002] The electrical and thermal conductivity of aluminum and aluminum alloys are close to those of copper, but their production and market costs are less than one-third of copper, so they are extremely cost-effective. Copper in components is replaced by aluminum; the dense oxides on the surface of aluminum and aluminum alloys are difficult to remove, and pure aluminum and aluminum alloys cannot form a firm metallurgical bond with lead-free solder. The existin...

Claims

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Application Information

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IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/362B23K35/40
Inventor 张新平周立兵周敏波
Owner SOUTH CHINA UNIV OF TECH
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