A kind of manipulator wafer centering device and method

Abstract

The invention provides a mechanical arm wafer centering device and method. The device comprises high-speed IO collecting circuits, an FPGA module and an embedded type CPU module. The high-speed IO collecting circuits are used for collecting AWC sensor signals and generating high-speed IO signals. The FPGA module is used for outputting high-speed IO signals and serial interruption signals to the embedded type CPU module, and the FPGA module is further used for converting address data of the embedded type CPU module into control signals to a driver and outputting the control signals to correct the position of a mechanical arm. The embedded type CPU module is used for receiving the high-speed IO signals and latching the servo axis position value, working out the deviation of the actual center in the wafer conveying process by the mechanical arm and a demonstration center according to the servo axis position value and outputting control instructions through the address data. According to the mechanical arm wafer centering device and method, the multiple sets of high-speed IO signal collecting circuits are integrated, the structure is compact, fault points are few, and the collecting circuits can be flexible configured.

Description

technical field [0001] The invention belongs to the field of mechanical control, and in particular relates to a manipulator wafer centering device and method. Background technique [0002] In the manufacturing process of semiconductors, manipulators are usually used between chambers or between stations to complete wafers (wafers refer to silicon wafers used in the production of silicon semiconductor integrated circuits. Because of their circular shape, they are called wafers. round) transmission. In the wafer transfer system, in order to avoid the occurrence of objective factors such as misalignment or wafer damage during pick-and-place, and to improve the accuracy of wafer pick-and-place, it is necessary to design and use the AWC (Active Wafer Centering) function for detection and correction. AWC wafer automatic centering function, aiming at the deviation between the actual center and the teaching center during the transfer of the wafer by the manipulator, automatically co...

AI Technical Summary

Problems solved by technology

This method needs to increase the interconnection cables and connectors from the interface board to the motion control card or driver, which leads to more failure points of the manipulator in the prior art, and the scattered structure is not conducive to maintenance.

At the same time, this method still cannot solve the problem that it does not support dual-axis or multi-axis synchronous triggering and latching

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