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Integrated lamp device and method used for producing integrated lamp device

A technology of equipment and filament, which is applied in the field of manufacturing the integrated lamp equipment, and can solve problems such as damage to the filament protection sleeve

Active Publication Date: 2015-05-20
AP SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention also provides an integrated lamp assembly and a method for manufacturing the integrated lamp assembly, which can basically solve the problem that the filament protection sleeve is damaged when the lamp is installed on the socket or separated from the socket

Method used

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  • Integrated lamp device and method used for producing integrated lamp device
  • Integrated lamp device and method used for producing integrated lamp device
  • Integrated lamp device and method used for producing integrated lamp device

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Experimental program
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Embodiment Construction

[0044] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, this invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, like reference numerals denote like elements.

[0045] image 3 A cross-sectional view for explaining a rapid thermal processing apparatus to which a heating block according to an exemplary embodiment is applied.

[0046] The processing chamber 200 has an inner space, which is a heat treatment space in which a substrate is heat treated, and the substrate is positioned in the heat treatment space. The processing chamber 200 is manufactured in an empty and sealed rectangular container shape, but is not limited thereto, and it...

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Abstract

The invention relates to an integrated lamp device and a method used for producing the integrated lamp device. The integrated lamp device comprises a lamp filament assembly used for producing lamp filaments producing heat; a heat-resistant reinforcing part, one end of which is fixedly coupled with the lamp filament assembly; a lead protection sleeve pipe, one end of which is fixedly coupled with the other end of the heat-resistant reinforcing part; a fixing part, which is fixedly coupled with the other end of the lead protection sleeve pipe; and a lead. One end of the lead is electrically connected with the lamp filament assembly, and can pass through the heat-resistant reinforcing part, the lead protection sleeve pipe, and the reinforcing part sequentially, and the other end of the lead is extended out of the fixing part. By adopting the integrated lamp device, the inconvenience of the workers of installing the lamp on the jack can be removed, and the service lifetime of the lamp can be prolonged.

Description

technical field [0001] The present invention relates to an integrated lamp device for heating a target object and a method for manufacturing the integrated lamp device. Background technique [0002] Heat treatment is a basic process in various processes for manufacturing semiconductors, displays, or the like. Ohmic contact blending, ion implantation damage annealing, dopant activation and formation of thin films such as TiN, TiSi2, CoSi2 or the like are processes that require heat treatment. [0003] Examples of equipment performing this heat treatment are electric furnaces and rapid thermal process (RTP) equipment. Because rapid thermal processing equipment has difficulties in maintaining the temperature of the entire area of ​​the substrate uniformly, maintaining the same temperature-time characteristics with respect to other substrates whenever the substrate (wafer) is replaced, or accurately measuring and controlling the temperature of the substrate , so rapid heat tre...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V21/002F21V23/06F21V19/00
CPCF21S2/00F21V19/00F21V21/002F21V23/06H05B3/0033H05B3/44H05B2203/017
Inventor 李成龙蒋盛旭池尙炫尹斗永
Owner AP SYST INC