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Integrated lamp device and method for manufacturing the same

A technology of equipment and filament, which is applied in the field of manufacturing the integrated lamp equipment, can solve the problems of damage of the filament protection sleeve and the like

Active Publication Date: 2018-01-16
AP SYST INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention also provides an integrated lamp assembly and a method for manufacturing the integrated lamp assembly, which can basically solve the problem that the filament protection sleeve is damaged when the lamp is installed on the socket or separated from the socket

Method used

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  • Integrated lamp device and method for manufacturing the same
  • Integrated lamp device and method for manufacturing the same
  • Integrated lamp device and method for manufacturing the same

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Embodiment Construction

[0044] Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. The present invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. In the figures, like reference numerals denote like elements.

[0045] image 3 A cross-sectional view for illustrating a rapid thermal processing apparatus to which a heating block according to an exemplary embodiment is applied.

[0046] The processing chamber 200 has an inner space, which is a thermal processing space in which a substrate is thermally processed, and the substrate is positioned in the thermal processing space. The process chamber 200 is fabricated in the shape of an empty and sealed rectangular container, but is n...

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Abstract

The invention relates to an integrated lamp device and a method used for producing the integrated lamp device. The integrated lamp device comprises a lamp filament assembly used for producing lamp filaments producing heat; a heat-resistant reinforcing part, one end of which is fixedly coupled with the lamp filament assembly; a lead protection sleeve pipe, one end of which is fixedly coupled with the other end of the heat-resistant reinforcing part; a fixing part, which is fixedly coupled with the other end of the lead protection sleeve pipe; and a lead. One end of the lead is electrically connected with the lamp filament assembly, and can pass through the heat-resistant reinforcing part, the lead protection sleeve pipe, and the reinforcing part sequentially, and the other end of the lead is extended out of the fixing part. By adopting the integrated lamp device, the inconvenience of the workers of installing the lamp on the jack can be removed, and the service lifetime of the lamp can be prolonged.

Description

technical field [0001] The present invention relates to an integrated lamp apparatus for heating a target object and a method for manufacturing the same. Background technique [0002] Thermal processing is a fundamental process in various processes used to manufacture semiconductors, displays or the like. Ohmic contact blending, ion implantation damage annealing, dopant activation, and formation of thin films such as TiN, TiSi2, CoSi2 or the like are processes that require thermal treatment. [0003] Examples of equipment that perform this heat treatment are electric furnaces and rapid thermal process (RTP) equipment. Because rapid thermal processing equipment has the difficulty of uniformly maintaining the temperature of the entire area of ​​the substrate, maintaining the same temperature-time characteristics with respect to other substrates whenever a substrate (wafer) is replaced, or accurately measuring and controlling the temperature of the substrate , so the rapid he...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F21S2/00F21V21/002F21V23/06F21V19/00
CPCF21S2/00F21V19/00F21V21/002F21V23/06H05B3/0033H05B3/44H05B2203/017
Inventor 李成龙蒋盛旭池尙炫尹斗永
Owner AP SYST INC