A method for generating a process for positioning a wafer on a processing tool
A processing machine and wafer technology, applied in special data processing applications, image data processing, electrical digital data processing, etc., can solve problems such as unresolvable recognition problems, few geometric figures, and misidentification of image recognition equipment
Active Publication Date: 2018-08-21
RAINTREE SCI INSTR SHANGHAI
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Problems solved by technology
On-machine image recognition equipment is often unable to match two images
and, Figure 1-6 There are relatively few characteristic geometric figures in it, which may easily cause misrecognition by image recognition equipment
Therefore even if the Figure 1-6 A new image added as an area of the original characteristic figure also does not solve the recognition problem
Method used
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[0035] In the following detailed description of the preferred embodiment, reference is made to the accompanying drawings which form a part hereof. The accompanying drawings show, by way of example, specific embodiments in which the invention can be practiced. The illustrated embodiments are not intended to be exhaustive of all embodiments in accordance with the invention. It should be noted that although the steps of the relevant methods in the present invention are described in a specific order in the accompanying drawings, this does not require or imply that these operations must be performed in this specific order, or that all shown operations must be performed to achieve the desired result. As a result, instead, the steps described herein can be performed in a different order. Additionally or alternatively, certain steps may be omitted, multiple steps may be combined into one step for execution, and / or one step may be decomposed into multiple steps for execution.
[0036...
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A method for a system to generate a recipe for performing wafer alignment, includes: generating first and second alignment data sets, the first alignment data set including image information regarding a first site on a wafer and coordinates of characteristic points at the first site, and the second alignment data set including image information regarding a second site different than the first site on the wafer and coordinates of characteristic points at the second site; and saving the generated first and second alignment data sets as a recipe for wafer alignment; wherein the generating of the first alignment data set includes: selecting, as the first site, a site including a characteristic pattern on the wafer; determining first and second characteristic points at the selected site; and recording coordinates of the determined first and second characteristic points.
Description
technical field [0001] The present invention relates to the technical field of semiconductor manufacturing, and more specifically, to a method for generating a process for positioning wafers on a processing machine, a method for adding a new positioning unit to the process, and using the process A method for positioning the wafer. Background technique [0002] In recent years, with the rapid development and wide application of electronic consumer goods, the demand for wafers, which are the basic raw materials of integrated circuit products, is also increasing. Wafer manufacturing and testing is an important process in the semiconductor manufacturing industry. Due to the precision of integrated circuits, precise processing and accurate detection of wafers are required. [0003] In the process of wafer processing and manufacturing or testing in semiconductor fabs, the precise position of the wafer must be determined first, and then the wafer can be fine-processed or accurate...
Claims
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IPC IPC(8): H01L21/02G06F17/50
CPCG06T7/337G06T2207/30148
Inventor 周坚
Owner RAINTREE SCI INSTR SHANGHAI