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Packaging housing structure suitable for SIP (System In Package) integration

A technology of encapsulation shell and flat shell, applied in electrical components, electric solid state devices, circuits, etc., can solve the problem of inability to meet the needs of complex system integration packaging, and achieve the effect of increasing the number of pins

Inactive Publication Date: 2015-06-03
XIAN TONGRUI NEW MATERIAL DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, with the development of integrated circuit technology, there are more and more system-level products, and the degree of integration is getting higher and higher, especially represented by SIP products. need

Method used

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  • Packaging housing structure suitable for SIP (System In Package) integration

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Embodiment Construction

[0009] The implementation of the present invention will be described in detail below in conjunction with the drawings and examples.

[0010] Such as figure 1 As shown, a package shell structure suitable for SIP integration includes a flat shell 2, and two rows of pins 1 are symmetrically arranged on both sides of the lower part of the flat shell 2. Among the two rows of pins 1, the pitch of each pin in each row is 2.54mm, a total of 7pins, and the row pitch of the two rows of pins 1 is also 2.54mm, wherein the horizontal direction of the second row and the first row is staggered by 1.27mm, ensuring that each The pins can be connected to the substrate using gold wires during internal assembly.

[0011] Compared with the prior art, the invention doubles the number of pins without increasing the area, and is suitable for complex integrated systems such as SIP.

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Abstract

The invention relates to a packaging housing structure suitable for SIP (System In Package) integration. The packaging housing structure comprises a flat housing, wherein two rows of pins are symmetrically arranged on the two sides of the lower part of the flat housing respectively. The packaging housing structure has the advantages that the two rows of pins are arranged on the bottom surface, so that the amount of the pins of modules is effectively improved, and the requirements of external pins of complex systems of SIP and the like can be met.

Description

technical field [0001] The invention belongs to the technical field of environmental protection, and in particular relates to a packaging shell structure suitable for SIP integration. Background technique [0002] The current circuit packaging shell leads a single row of pins from the bottom surface and inserts them on the device, which can meet the needs of most circuits. However, with the development of integrated circuit technology, there are more and more system-level products, and the degree of integration is getting higher and higher, especially represented by SIP products. need. Contents of the invention [0003] In order to overcome the above-mentioned shortcomings of the prior art, the object of the present invention is to provide a packaging shell structure suitable for SIP integration, the pins are led out from the bottom surface in 2 rows, increasing the number of pins, and suitable for SIP integration of complex systems. [0004] In order to achieve the abov...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/04
Inventor 刘宝华
Owner XIAN TONGRUI NEW MATERIAL DEV
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