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Microelectromechanical system and methods of use

A technology of microelectronic machinery and execution system, which is applied in the direction of microelectronic microstructure devices, circuits, electrical components, etc., and can solve problems such as structural size mismatch

Inactive Publication Date: 2015-06-03
PURDUE RES FOUND INC
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Problems solved by technology

However, when fabricating MEMS devices, the dimensions of the fabricated structures often do not match the dimensions specified in the layout

Method used

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  • Microelectromechanical system and methods of use
  • Microelectromechanical system and methods of use
  • Microelectromechanical system and methods of use

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[0166]The following documents are also cited, the disclosure of each is hereby incorporated by reference.

[0167] [A10] F.Li, J.V.Clark, "Self-Calibration for MEMS with Comb Drives: Measurement of Gap" Journal of Microelectromechanical Systems, accepted May, 2012 .

[0168] [B13] Clark, J.V., 2012, "Post-Packaged Measurement of MEMS Displacement, Force, Stiffness, Mass, and Damping," International Microelectronics and Packaging Society.

[0169] [B14] Li.F, Clark, J.V., 2012, "Self-Calibration of MEMS with Comb Drives: Measurement of Gap", Journal of Microelectromechanical Systems, Dec.2012.

[0170] [D12] J.V.Clark, "Post-Packaged Measurement of MEMS Displacement, Force, Stiffness, Mass, and Damping", International Microelectronics and Packaging Society, March (2012).

[0171] Symbols (eg, Δgap) for various quantities are used herein. Throughout this disclosure, italicized and non-italicized variants of these symbols (eg, "Δgap" and "Δgap") are equivalent.

[0172] Va...

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Abstract

Methods of measuring displacement of a movable mass in a microelectro- mechanical system (MEMS) include driving the mass against two displacement-stopping surfaces and measuring corresponding differential capacitances of sensing capacitors such as combs. A MEMS device having displacement-stopping surfaces is described. Such a MEMS device can be used in a method of measuring properties of an atomic force microscope (AFM) having a cantilever and a deflection sensor, or in a temperature sensor having a displacement-sensing unit for sensing a movable mass permitted to vibrate along a displacement axis. A motion-measuring device can include pairs of accelerometers and gyroscopes driven 90° out of phase.

Description

[0001] Cross References to Related Applications [0002] This application is Ser. No. 61 / 659,179 filed June 13, 2012, 61 / 723,927 filed Nov. 8, 2012, 61 / 724,325 filed Nov. 9, 2012, Nov. 9, 2012 U.S. Provisional Patent Applications 61 / 724,400 filed on November 9, 2012, and U.S. Provisional Patent Applications 61 / 659,068 filed on June 13, 2012 and claiming that the U.S. provisional Priority of patent applications, each of which is incorporated by reference in its entirety. technical field [0003] This application relates to microelectromechanical systems (MEMS) and nanoelectromechanical systems (NEMS). Background technique [0004] Microelectromechanical systems (MEMS) are typically fabricated on silicon (Si) and silicon-on-insulator (SOI) wafers, much like standard integrated circuits. However MEMS devices include moving parts on a wafer as well as electrical components. Examples of MEMS devices include gyroscopes, accelerometers, and microphones. MEMS devices can also in...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00G01C19/56G01P15/00
CPCB81B2201/0235B81B2201/033B81C99/003G01C19/5755G01P15/097G01P15/125G01P21/00G01P2015/0871G01Q40/00B81B3/0051B81C99/0045G01K11/00G01Q20/00
Inventor J·V·克拉克
Owner PURDUE RES FOUND INC
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