Defect identification method of eddy current thermal imaging based on similarity analysis of three-dimensional temperature surface
A similarity analysis and three-dimensional temperature technology, applied in the field of eddy current thermal imaging non-destructive testing, can solve the problems of high labor intensity for operators, immature research on thermal image recognition algorithms, and no method for identifying defects, etc., to achieve light labor The effect of improving the detection efficiency
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[0030] In order to make the content and technical solutions of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0031] The eddy current thermal imaging defect recognition method based on the similarity analysis of the three-dimensional temperature surface in the embodiment of the present invention, such as figure 1 shown, including the following steps:
[0032] S1. Use eddy current to heat the test piece to be tested, and use an infrared thermal imager to record the temperature change on the surface of the test piece to obtain its thermal images at different times;
[0033] S2. Establish a three-dimensional temperature surface of the test piece according to the information of the thermal image, and then calculate the normal vectors of each point on the three-dimensional temperature surface to form a normal vector matrix;
[0034] S3. Perform a similarity analysis between the normal ...
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