Lithographic alignment mark structure and manufacturing method thereof

A technology of lithography alignment and manufacturing method, which is applied in microlithography exposure equipment, optics, photoplate making process of pattern surface, etc., which can solve the limitation of layout design and publication, poor alignment, and doubts about vector fitting and other problems to achieve the effect of solving the lack of cutting space, reducing errors and high-order parts, and avoiding unpredictability
CN104698773BActive Publication Date: 2017-06-16SHANGHAI HUALI MICROELECTRONICS CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI HUALI MICROELECTRONICS CORP
Publication Date
2017-06-16

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Abstract

The present invention provides a photolithographic alignment mark structure and its manufacturing method, which is a multi-level mutual alignment precision pattern structure design and its manufacturing method. When projecting, they are all center-symmetric figures relative to the same center, and the projections of all lithography alignment figures are nested and expanded from inside to outside according to the formation sequence of lithography alignment figures, which can be applied to various lithography processes. According to different needs, it can be matched at will to meet the alignment requirements that are constant and changeable, and can meet the mutual alignment requirements of lithography alignment marks between different layers. At the same time, it can take into account the traditional alignment measurement and 3 exposures, 4 exposures The alignment measurement required for the second exposure, and it saves the space of the cutting line and reduces the cost.
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Description

technical field

[0001] The invention relates to the field of semiconductor manufacturing, in particular to a photolithographic alignment mark structure and a manufacturing method thereof. Background technique

[0002] With the continuous improvement of integrated circuit manufacturing technology and the continuous shrinking of line width, the area of ​​semiconductor devices is becoming smaller and smaller, and the layout of semiconductors has evolved from ordinary single-function separation devices to integrated high-density and multi-functional integrated circuits; From the initial IC (integrated circuit) to LSI (large-scale integrated circuit), VLSI (very large-scale integrated circuit), until today's ULSI (ultra-large-scale integrated circuit), the area of ​​the device is further reduced, and the functions are more comprehensive and powerful. Considering the complexity of process research and development, long-term and high cost and other unfavorable factors, how to furth...

Claims

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