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Method for reducing backside die damage during die separation process

A bare chip and back surface technology, applied in semiconductor/solid-state device components, semiconductor devices, electrical components, etc.

Active Publication Date: 2015-06-10
TEXAS INSTR INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Existing arrangements and methods for dicing semiconductor wafers exhibit backside damage and flying dies of small dies

Method used

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  • Method for reducing backside die damage during die separation process
  • Method for reducing backside die damage during die separation process
  • Method for reducing backside die damage during die separation process

Examples

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Embodiment Construction

[0023] The present invention is described with reference to the accompanying drawings. The figures are not drawn to scale and are provided merely to illustrate the invention. Several aspects of the invention are described below with reference to example applications for illustration. It should be understood that numerous specific details, relationships, and methods are set forth to provide an understanding of the invention. One skilled in the relevant art will readily recognize, however, that the present invention may be practiced without one or more of these specific details, or with other methods. In other instances, well-known structures or operations have not been shown in detail to avoid obscuring the invention. The invention is not limited by the illustrated ordering of acts or events, as some acts may occur in different orders and / or concurrently with other acts or events. Moreover, not all illustrated acts or events are required to implement a methodology in accorda...

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Abstract

In one aspect of the present invention, a method of sawing a semiconductor wafer will be described. A semiconductor wafer is positioned in a wafer sawing apparatus that includes a sawing blade and a movable support structure that physically supports the semiconductor wafer. The semiconductor wafer is coupled with the support structure with various layers, including a dicing tape and an anchoring material. The anchoring material and the wafer are cut with the sawing blade. During the cutting operation, the anchoring material reduces backside chipping of the die and eliminates fly-away die. Various aspects of the present invention relate to arrangements and a wafer sawing apparatus that involve the aforementioned sawing method.

Description

technical field [0001] The present invention relates to integrated circuit packaging. More specifically, the present invention relates to methods and arrangements for sawing and separating dies on semiconductor wafers. Background technique [0002] There are various ways to form integrated circuits. One conventional approach involves forming various devices and interconnects on a sheet of semiconductor material. These operations form multiple replicas of the same integrated circuit design 105 separated by saw streets on a single semiconductor wafer 101 . [0003] refer to figure 1 , followed by dicing or sawing the semiconductor wafer 101 using a sawing machine (not shown) to separate the integrated circuits. [0004] A sawing machine (not shown) consists of a saw blade 102, a motor (not shown) that drives the saw blade 102, and a chuck table 103 that moves back and forth under the saw blade to make linear cuts along the saw lanes of the wafer. [0005] The wafer is mou...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304
CPCH01L2224/27848H01L21/561H01L23/562H01L24/27H01L24/29H01L24/32H01L24/48H01L21/6836H01L24/73H01L24/83H01L24/97H01L2224/2732H01L2224/27416H01L2224/27436H01L2224/2919H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/83193H01L2224/94H01L2224/97H01L23/49513H01L23/49548H01L2221/68327H01L2924/181H01L21/3043H01L2924/00014H01L21/78H01L2224/27H01L2924/00012H01L2224/83H01L2224/85H01L2924/00H01L2224/45099H01L2224/45015H01L2924/207
Inventor 入口正一中西腾
Owner TEXAS INSTR INC
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