Sample transfer and mask setup for thin film deposition equipment systems

Abstract

The invention relates to configuration of high-vacuum and ultrahigh-vacuum equipment systems, in particular to a sample transfer and mask device for a thin-film deposition equipment system. The sample transfer and mask device comprises a mask plate transfer device, a mask plate, a detachable sample tray, a baffle, a cooling water pipe and a sample transfer rod, wherein the device is integrated with thin-film deposition equipment and is in a complete sealed state, and the high-vacuum or ultrahigh-vacuum state of the equipment system is not required to be interrupted during loading and unloading of a sample; the sample can be conveniently and reliably fixed, cannot fall when a sample table rotates in site or moves relatively in the technological process and cannot be influenced by the technological process such as thermal radiation during in-site high-temperature annealing; the position of the mask plate relative to the sample table can be adjusted accurately, and whether the mask plate and the sample, namely a clamp, are separated or attached can be accurately controlled; the mask plate can perform positioned displacement relative to the sample table and can also perform continuous displacement; the mask plate and motion control of the mask plate cannot be influenced by the high-temperature process.

Description

Technical field [0001] The invention relates to the configuration of high-vacuum and ultra-high-vacuum equipment systems, in particular to a sample transfer and masking device for thin film deposition equipment systems. Background technique [0002] Driven by Moore's Law, the size of semiconductor microelectronic devices is rapidly shrinking to the nanometer scale by exponential magnitude. High-vacuum and ultra-high-vacuum film deposition preparation has become an indispensable method for modern semiconductor microelectronics and ultra-micro integrated circuit technology. In order to achieve continuous operation in high vacuum and ultra-high vacuum, avoid contamination of the film deposition process, and improve work efficiency, a sample transfer system is usually used to transfer samples from the atmospheric atmosphere to the high vacuum and ultra-high vacuum chambers. [0003] High-throughput combination semiconductor material chip synthesis technology, through thin film deposit...

AI Technical Summary

Problems solved by technology

On the one hand, since the mask has a certain thickness, when multi-level mask is used for layer-by-layer deposition, if the pattern dislocation of the mask pattern of each level occurs, and the shadowing effect at the edge of the array pattern will cause the film coverage to be missing or not uniform, resulting in the inability to form the desired material database

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